Electronics Forum | Mon Nov 21 09:23:06 EST 2005 | Amol
With a BGA, how much solder paste are you putting on the pads? sometimes, bridging occurs when there is more solder paste than needed during reflow.....just a thought
Electronics Forum | Tue Dec 06 06:14:38 EST 2005 | bwet
Try using some of those new polyimide stencils. They are 8mils thick and can prevent shorting if it is due to solder mask problems or too much paste. http://www.solder.net/technical/tips.asp BWET
Electronics Forum | Thu Mar 20 08:45:02 EDT 2008 | davef
Common methods use to protect pads from solder splatter are: * No residue Kapton tape * Nonionic solder mask
Electronics Forum | Wed Nov 23 07:39:14 EST 2005 | chunks
Shorted to the sheild or the BGA balls are shorted? Sheilds move a lot during reflow. If this is the case, place some adhesive or peelable solder mask on either side of the shield and baords to stop it from moving.
Electronics Forum | Mon Mar 17 07:00:34 EDT 2008 | ectan5117
Hi, During SMT process, i found that solder splash on the gold pad. The distance between the COB pad with component pad is about 1.25mm. My question is what material can used to cover the COB pad without bringing contamination. And i am welcome to
Electronics Forum | Fri Nov 25 09:31:56 EST 2005 | davef
pyramus, First, search the fine SMTnet Archives for previous discussions on BGA shorts. Second, we're still not clear on the issue. * Is the problem with a BGA? If so, please describe the BGA, including any heat spreader * Is the problem with a uB
Electronics Forum | Tue Nov 22 10:12:13 EST 2005 | stepheniii
Have you complained yet to MuRata? You are talking about the same bluetooth module, aren't you. I hope everybody having trouble with module complains to them. I don't believe they put all the cautions and warnings about reducing the deltaT on the da
Electronics Forum | Fri Jun 02 10:23:13 EDT 2023 | jalina
Nowaday,more and more assembly line of factory face issue of BGA calibrate,I am very sincerely to ask for solution how to avoid this issue,may there some asset here to give?tks.
Electronics Forum | Thu Jun 08 01:46:00 EDT 2023 | camilleyang3
To prevent BGA (Ball Grid Array) issues related to SMT (Surface Mount Technology) solder resist when fabricating a PCBA (Printed Circuit Board Assembly), you can follow these guidelines: Design considerations: Ensure proper spacing between BGA pads
Electronics Forum | Thu Sep 27 17:25:33 EDT 2007 | chef
The short answer is immediately after reflow the problem occurs. To be more exact, what you are describing is not "rust". Rust occurs in iron. The oxidation that occurs in Tin-Lead has been sometimes called "white rust". Either way, oxidation occur
