Electronics Forum: humidity and relative and value (Page 1 of 2)

How does temperature and humidity effect solder paste/printing

Electronics Forum | Wed Apr 11 22:05:58 EDT 2001 | davef

OA pastes are more hydroscopic than NC pastes. Hydroscopic. The capacity of a material to absorb and retain moisture from the ambient air. Sometimes this is compounded if you remove paste from the frig and let it warm to room temperature, because

Need help on assessment of effect of temperature and humidity in battery consumption

Electronics Forum | Tue Apr 24 21:00:58 EDT 2018 | marlonbc

Hi All, Would just like to course through this concern on a product that we are contracted to assemble. It is mainly used for an automatic hand sanitizer dispensing product. By design there is a restrictive value of current that it needs to dissipat

Solder Balls and Humidity

Electronics Forum | Tue Aug 28 11:12:23 EDT 2007 | grics

This is what I was thinking, but I am being beat up pretty badly by the selective solder. Ambient temperature is anywhere in the the neighborhood of 76 - 80 degrees F. I am not sure of the RH, but I wouldn't think that would be my issue... One of

Cp and Cpk values

Electronics Forum | Mon Mar 03 11:06:13 EST 2003 | msivigny

Hi floydl, I completely understand when it comes to data crunching after long hours of performing measurements, it's the last and most important arduous task in obtaining performance data. If a measurement and evaluation process that traditionally to

OSP and SIR

Electronics Forum | Wed Aug 21 17:44:32 EDT 2002 | davef

Splitting hairs, I expect SIR of all solderability protection, including OSP, to decrease after reflow. What�s more, I expect the SIR of all solderability protection to pretty much decrease over time. The �comb pattern� test specimens meet requirem

High Relative Humidity and Blistering Issues in Assembly

Electronics Forum | Mon Sep 08 21:12:29 EDT 2014 | eurekadrytech

Hello, Manufacturing process with high moisture and humidity environments and long term storage will definitely see pop corning effects once high temperature from soldering and/or re-flow process. The moisture that has been adsorbed is likely the ro

J-STD-001 Par 4.2.2 Temperature and Humidity

Electronics Forum | Tue Jul 17 21:48:09 EDT 2007 | davef

Per ESD Handbook TR 20.20 paragraph 5.3.15 Humidity "Humidity is beneficial in all ESD Control Program Plans. Contact and separation of dry materials generates greater electrostatic charges than moist materials because moisture provides conductivity

J-STD-001 Par 4.2.2 Temperature and Humidity

Electronics Forum | Mon Jul 16 15:44:27 EDT 2007 | davef

J-STD-001 doesn't necessarily require additional controls under conditions of low humidity, only that you verify the effectiveness of what you have in place. ESD S20.20 [1999] only says that relative humidity above 30% is "desirable". ESD S20.20 [200

Re: Humidity Control and Moisture Sensitivity

Electronics Forum | Tue Dec 05 15:10:55 EST 2000 | Francois Monette

Victor, here are a few more elements of information to answer your question. Both the temperature and relative humidity on the manufacturing floor have a significant impact relative to the rate of diffusion of moisture inside a plastic package and t

SMT Solder paste and wave flux evaluation

Electronics Forum | Tue Feb 01 09:53:37 EST 2005 | Howard Sommerfeld

I also have a spreadsheet tool for comparative analysis using criterion weighted scoring. It can be used to analyze any decision, and helps groups reach consensus on why a particular alternative is the way to go. As final steps you can also consider

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