Electronics Forum: hybrid profile (Page 1 of 6)

hybrid solder joints

Electronics Forum | Thu May 13 21:45:14 EDT 1999 | ardis

I am seeing reflow around my signal pins after being subjected to a profile of 204c for 1 minute and 225c for a min of 30 seconds. Signal pins are soldered into a copper plated alum. case with SB5 and then silver plated. The pins have a hot oil tin

Re: hybrid solder joints

Electronics Forum | Fri May 14 00:28:09 EDT 1999 | Mike D.

| I am seeing reflow around my signal pins after being subjected | to a profile of 204c for 1 minute and 225c for a min of 30 seconds. Signal pins are soldered into a copper plated alum. case with SB5 and then silver plated. The pins have a hot oil

Hybrid reflow profile

Electronics Forum | Mon Oct 03 10:20:43 EDT 2005 | davef

Follow your component supplier recommendations. For instance: Xilinx says their lead-free alloy for their BGA spheres is SnAgCu, and liquidous is 217*C and they want you to peak at 230 - 235*C for good wetting according to their reflow guidelines.

Hybrid reflow profile

Electronics Forum | Sat Oct 01 01:25:30 EDT 2005 | ck

Sorry theres a mistake on previous question. It should be lead free component termination but non lead free solder alloy Sn63/Pb37. The reflow profile i am using : Soaking temp. 120 to 160 deg C; time 90 to 120 sec. Peak temp. 215 to 225 deg C; time

Hybrid Profile

Electronics Forum | Sat Apr 15 09:07:22 EDT 2006 | samir

Amol, We pulled off this "hybrid profile" with a leaded solder paste. We recently got our tensile test report results, and our Pb-Free BGA / Pb Paste sample broke off during tensile tests at the pad/substrate interface, and not the joint. This ind

Pb-Free BGA on SnPb Assemblies

Electronics Forum | Thu May 08 08:07:24 EDT 2008 | tazzntigger

I am with Rwyman. This "hybrid" profile is also used for reworking the BGA's.

Hybrid reflow profiles

Electronics Forum | Mon Oct 03 12:28:33 EDT 2005 | russ

search the archives!

Hybrid Profile

Electronics Forum | Tue Nov 14 03:48:08 EST 2006 | aj

Hi, What is the non-leaded part ? the only real obstacle I have found is when using a Leadfree BGA with PB Paste. We have had to do this in the past - the hybrid profile I used was pretty much the same as normal apart from increasing the peak temp

Hybrid Profile

Electronics Forum | Sun Nov 12 09:40:47 EST 2006 | Andrew

Can someone help me to advise the best profile for a board with the combination of both Lead Free and Non-Leaded part?If possible,pls advise the best preheat and reflow time and temprature.

Hybrid reflow profiles

Electronics Forum | Tue Oct 04 03:16:14 EDT 2005 | grantp

Hi, I thought it was extreemly bad to use lead based parts with lead free solder? Regards, Grant

  1 2 3 4 5 6 Next

hybrid profile searches for Companies, Equipment, Machines, Suppliers & Information

Selective soldering solutions with Jade soldering machine

Reflow Soldering 101 Training Course
Equipment Auction - Eagle Comtronics: Low-Use Electronic Assembly & Machining Facility 2019 Europlacer iineo + Placement Machine  Test & Inspection: Agilent | Tektronix | Mantis Machine Shop: Haas VF3 | Haas SL-20 | Mult. Lathes

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
Pillarhouse USA for Selective Soldering Needs

High Throughput Reflow Oven
Software for SMT

World's Best Reflow Oven Customizable for Unique Applications
Electronics Equipment Consignment

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...