Electronics Forum: hybrid profile (Page 1 of 6)

hybrid solder joints

Electronics Forum | Thu May 13 21:45:14 EDT 1999 | ardis

I am seeing reflow around my signal pins after being subjected to a profile of 204c for 1 minute and 225c for a min of 30 seconds. Signal pins are soldered into a copper plated alum. case with SB5 and then silver plated. The pins have a hot oil tin

Re: hybrid solder joints

Electronics Forum | Fri May 14 00:28:09 EDT 1999 | Mike D.

I am seeing reflow around my signal pins after being subjected to a profile of 204c for 1 minute and 225c for a min of 30 seconds. Signal pins are soldered into a copper plated alum. case with SB5 and then silver plated. The pins have a hot oil

Hybrid reflow profile

Electronics Forum | Mon Oct 03 10:20:43 EDT 2005 | davef

Follow your component supplier recommendations. For instance: Xilinx says their lead-free alloy for their BGA spheres is SnAgCu, and liquidous is 217*C and they want you to peak at 230 - 235*C for good wetting according to their reflow guidelines.

Hybrid reflow profile

Electronics Forum | Sat Oct 01 01:25:30 EDT 2005 | ck

Sorry theres a mistake on previous question. It should be lead free component termination but non lead free solder alloy Sn63/Pb37. The reflow profile i am using : Soaking temp. 120 to 160 deg C; time 90 to 120 sec. Peak temp. 215 to 225 deg C; time

Hybrid Profile

Electronics Forum | Sat Apr 15 09:07:22 EDT 2006 | samir

Amol, We pulled off this "hybrid profile" with a leaded solder paste. We recently got our tensile test report results, and our Pb-Free BGA / Pb Paste sample broke off during tensile tests at the pad/substrate interface, and not the joint. This ind

Pb-Free BGA on SnPb Assemblies

Electronics Forum | Thu May 08 08:07:24 EDT 2008 | tazzntigger

I am with Rwyman. This "hybrid" profile is also used for reworking the BGA's.

Hybrid reflow profiles

Electronics Forum | Mon Oct 03 12:28:33 EDT 2005 | russ

search the archives!

Hybrid Profile

Electronics Forum | Tue Nov 14 03:48:08 EST 2006 | aj

Hi, What is the non-leaded part ? the only real obstacle I have found is when using a Leadfree BGA with PB Paste. We have had to do this in the past - the hybrid profile I used was pretty much the same as normal apart from increasing the peak temp

Hybrid Profile

Electronics Forum | Sun Nov 12 09:40:47 EST 2006 | Andrew

Can someone help me to advise the best profile for a board with the combination of both Lead Free and Non-Leaded part?If possible,pls advise the best preheat and reflow time and temprature.

Hybrid reflow profiles

Electronics Forum | Tue Oct 04 03:16:14 EDT 2005 | grantp

Hi, I thought it was extreemly bad to use lead based parts with lead free solder? Regards, Grant

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