Electronics Forum: ic and component and lead and times (Page 1 of 5)

Heat guns and component damage

Electronics Forum | Tue Jan 31 13:41:12 EST 2006 | outgasser

We are currently experiencing problems with delamination during rework/2nd op activity on lead free. I am suspecting this is a result of the use of a heat gun to rework components. My assumption is that the high heat and time in area greatly increa

lead free platings and tin lead

Electronics Forum | Tue Aug 31 21:45:49 EDT 2004 | KEN

I have experienced this directly in SMT and wave solder. Fillet lift (can) be a direct indicator to lead enrichment (but its not the exclusive symptom). Lead enrichment in smt joints reduces the interfacial strength shortening the time to creep f

lead free platings and tin lead

Electronics Forum | Tue Aug 31 17:36:36 EDT 2004 | davef

NO-LEAD COMPONENTS WITH LEAD SOLDER ISSUE: We agree with Russ. We've dicussed this several times on SMTnet. For instance, look here http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=25394 LEAD COMPONENTS WITH NO-LEAD SOLDER ISSUE: We disa

Time and temp in lead and lead-free reflow

Electronics Forum | Sat Aug 02 08:06:11 EDT 2008 | pcbbuilders

Is there a limit to the time that most components can stay at temperatures around 130-200 deg c? if i slow the time, the first 4 zones will be at this temp for about 5 minutes in no lead process. i am concerned that some chips wont be rated at this t

Time and temp in lead and lead-free reflow

Electronics Forum | Mon Jul 28 14:30:22 EDT 2008 | grics

Take a look at this. Remember, these are only guidlines and can not replace any paste specs. As Real Chunks said, a profiler will be of HUGE help. We use this to determine what our top side temps are and to see if we have any problems with heat sen

Time and temp in lead and lead-free reflow

Electronics Forum | Mon Aug 04 09:30:16 EDT 2008 | grics

If you have concerns, you can look at the datasheet for each component or contact one of their application or materials engineers and find out what the components are rated for...process-wise. IE, how long can I be in the oven with this part, at what

Use and Restrictions of solder containing lead

Electronics Forum | Thu May 29 17:48:00 EDT 2003 | jonfox

As far as I know, the limitations apply to to the manufacturing components, not the equipment per say. At this point there is no set date for the US at the national level. Basically our government is run by big businesses and their effect on our na

Solder climbs on the lead and touches the body of the component

Electronics Forum | Mon May 12 12:58:07 EDT 2014 | emeto

Hello all, I have a diode(gold plated)on some assemblies that gives me a a hard time. The paste is wetting too good and climbs the lead of the component and touches the body which is a defect. I just wonder what if there is a way to heat the board e

Comparison between Vitech and Mirtec

Electronics Forum | Mon Jan 10 18:35:05 EST 2011 | eadthem

Ive used a Mirtec machine for 3 years MV3L with side angle inspection. Mirtec has some issues documentation, and repair plus. But there machine is impressive and the AOI software is good. We can find about 90-99.99% of all errors using just the 5

tape and reel components

Electronics Forum | Mon Sep 16 12:55:27 EDT 2002 | davef

We send parts out to be tape & reeled. We do not send all loose parts out to be tape & reeled. As you would expect, we base our decision on: * T&R service company lead time * Our production schedule * Cost benefit of T&R versus some other productio

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