Electronics Forum | Tue Sep 10 05:39:04 EDT 2019 | richgreen01
Hi all. I have put.an ic on the y wagon and done first.and last component. The machime picked up the part while testing the package but it didnt center the part ,just sat there for a while and failed. Any idea why this is and am I missing something?
Electronics Forum | Thu Apr 28 17:09:28 EDT 2005 | jsloot
Does anyone have any articles about performing the green stick test for IC leads? If there are no printed articles then perhaps I can get a good description from you on the proper usage of one. I would like to know from your experiences any pros and
Electronics Forum | Wed Jan 04 12:48:34 EST 2006 | pjc
In-Circuit Test is the best method for ensuring solder joint connections. It is a much more reliable than AOI. An ICT machine can ensure solder connections are made for array package devices such as BGA, PGA, etc... AOI is best for component I.D.- is
Electronics Forum | Mon Dec 18 01:25:47 EST 2006 | seety1981
test engineer and product engineer... Hi all, Sorry if this topic is not suitable to be in this forum.. anyway,... i would like to know what the different of the jobs scope between the Test Process and Test Product engineer in semiconductor manufac
Electronics Forum | Sun Jun 07 19:09:21 EDT 1998 | Graham Naisbitt
Chiakl Ion Chromatography has been perfectly described by Dave, but here are a couple of extra considerations: Ion Chromatography will tell you precisely what is present on the surface of your board/assembly but it will not tell you whether it will b
Electronics Forum | Mon Jun 08 20:03:07 EDT 1998 | Dave F
| Chiakl | Ion Chromatography has been perfectly described by Dave, but here are a couple of extra considerations: | Ion Chromatography will tell you precisely what is present on the surface of your board/assembly but it will not tell you whether it
Electronics Forum | Tue Feb 04 08:32:49 EST 2003 | roertner
In my experience AOI's are good for checking machine setup I.E. first piece inspection. After that the only things they will typically catch are wrong parts, reversed parts, missing parts, and tombstones. I would however suggest getting an AOI with a
Electronics Forum | Fri Jun 01 06:40:39 EDT 2012 | umar
Hi Norman... Thansk on yoru input, actually my adhesion test conduct is after pass of IC test. MY IC Test is shown a good result but when go into teh Test adhesion coating then during peel off test my board was failed.
Electronics Forum | Tue Apr 12 15:50:14 EDT 2011 | cstev112
New to using Ion Chromatography (IC)testing to understand cleanliness of PCB. I've been informed that one method to monitor is to use R/O/I. What is R/O/I?
Electronics Forum | Tue Jul 19 21:24:04 EDT 2005 | davef
This is a bit dated, but it'll give you a starting point. test lab failure analysis IC; Accurel Materials Analysis Group (FIB, FESEM,TEM) 785 Lucerne Dr Sunnyvale, CA 94086; 408-737-3892 Fax 3916 Suzanne Francisco X146 suzannef@accurel.com test la
