Electronics Forum | Wed Apr 27 11:43:32 EDT 2005 | patrickbruneel
Hi Daan, What we did in the time was pareto analyses on all board designs to determine the critical areas (mainly design errors) and only inspect those specific problem areas. Every batch had a copy of the PC board with problem areas marked and only
Electronics Forum | Wed Mar 31 21:02:53 EST 2004 | darburch
If you find your self interested in an electrovert machine we have a UP600 for sale, a good machine if you have experience with electrovert. As for a buying guide I'm not sure if there is a reliable source who has compared the different models.
Electronics Forum | Mon Mar 17 03:50:12 EDT 2008 | Sean
Hi All, Besides the above question, I have another one as below: (1) How frequent that we need to perform strain gauge study on ICT, Functional test fixture? Is it a necessary to perform this study each time after ICT, Funtional test fixture preve
Electronics Forum | Thu Aug 24 16:08:18 EDT 2006 | Frank R.
Thanks Bill and Dave for your help, Sorry Dave if I didn't search for information in archives. After wave process we have 2 ICT, 2 AOI machines 4 PVA conformal coating machine that will be use on 3 different lines. The quind of automation I want to
Electronics Forum | Fri Mar 19 12:17:15 EDT 2010 | stepheniii
Be carefull if you go to no clean. Or be prepared from complaints from the test department regarding their ICT pins getting dirty.
Electronics Forum | Tue Mar 19 17:30:46 EST 2002 | rculpepp
Does anyone have or know of any published guidelines for BGA layout on PWB's so that they can be tested. Specifically using micro vias? If anyone has any input regarding other test considerations for BGA devices I'd like to hear from you as well. W
Electronics Forum | Tue May 09 14:49:57 EDT 2006 | Larry
Hey guys, Anybody having trouble with increased false contact issues in ICT after switching from lead to lead free? Our test guys keep trying to imply that the flux residues are a problem (we're using Alpha EF2202), but as the soldering process eng
Electronics Forum | Sat Jun 03 03:35:16 EDT 2006 | mika
Yes we do have a problem with this. We have by now investigate numerous lead/RoHS PCBA:s The RoHS boards are by far the most difficult one's to probe and test. Our people at the "test area" including Flying Probe and ICT they spend a lot of time to t
Electronics Forum | Wed Mar 20 07:57:30 EST 2002 | davef
Purchase: 7095 - Design and Assembly Process Implementation for BGA's Make every effort to distribute the test pads, because if you keep them massed at the ball, it would be a bijundo kick in the BGA rear section, when all of those pins released.
Electronics Forum | Wed Mar 20 15:18:09 EST 2002 | angiewest
You may want to check out IPC-SM-782 "Surface Mount Design and Land Pattern Standard" http://www.ipc.org Good Luck
