Electronics Forum | Tue Apr 23 01:39:29 EDT 2002 | ianchan
Hi, 1) Was reading the links provided by Dave F, under the thread "waste" which was about the ESD grounding of drums. 2) thanks to Dave F, now have "back-bone" refer sources to explain ESD terms to those who ask and seek to better understand this n
Electronics Forum | Wed Jun 26 00:49:52 EDT 2002 | ianchan
Steve, I'd second Daan's opinion. BGA profile we use gets a peak of 210deg-C to 223deg-C (but that's using our WS paste unique characteristics) with reflow zone holding time of 45-60sec. We had 6 PBGA and 2 ceramic BGA on a 6 layer PCB. typical p
Electronics Forum | Tue Jul 09 00:06:34 EDT 2002 | kenbliss
One thing that is a constant in the electronics assembly world is change. What ever you setup now be sure to think about what might change in the not to distant future. My experience says that you want ESD flooring, although cost of course is a nec
Electronics Forum | Wed Jul 10 18:05:11 EDT 2002 | mikestringer
What have your experiences been with static meters for maintaining your ESD program? As part of our ESD program I am after an improved method of identifying risk items, or items not performing to specification. We use wrist and foot straps, ESD flo
Electronics Forum | Mon Nov 04 15:34:26 EST 2002 | pjc
An effective method to compare the two machines is to go to each vendor's nearest demo facility. Go there with PWBs, components and board data. Find out from each vendor what the minimum board data they'll need- like X-Y Centroid, Theta and Reference
Electronics Forum | Thu Nov 07 10:59:11 EST 2002 | pjc
IPC-7525 "Stencil Design Guidelines" is a good reference document to have. Here are notes from a Tessera, (a major mBGA mfg.), study- "Application Note Solder Stencil Requirement for mBGA" The stencil aperture is to be square, equal in size to the l
Electronics Forum | Wed Mar 05 12:23:31 EST 2003 | msivigny
Hello Phil, We did use an Oracle relational database with an Access front end to input and query data from the system for reports. We did not perform SPC with the Oracle dB. As the whole data collection process was completely customized, we hadn't im
Electronics Forum | Wed Jun 23 10:26:53 EDT 2004 | exmaintenanceleader
Grant and all! CP-2 is the oldest fuji as I have been operated. CP-3 is built in 1989 as a new mc. Now 15 mc I now they runs in 3 shift widouth problems when they need countinous runing comes the problems. conroll card and relay contact problems at
Electronics Forum | Thu Jun 24 14:34:13 EDT 2004 | tjensen
There are many factors that can lead to solder balls. Since you have just recently seen this start to occur, it is obvious something has changed in the product or your process. Since we don't have a lot of details about your process, I would sugges
Electronics Forum | Wed Aug 25 19:35:48 EDT 2004 | russ
This is highly dependent upon your board, vision inspection, part rotation, part type, layout, number of P/Ns per (1 pers or 100 pers) feeder layout, optimization, nozzle changes, etc... all have significant impact on placement speed. I find if you
