Used SMT Equipment: image sensors (Page 1 of 3)

Samsung SM411

Samsung SM411

Used SMT Equipment | Pick and Place/Feeders

Device Name: Samsung SM411, Samsung SM411 Mater, Second-hand Samsung SM411 Mater Equipment Profile: The SM411 uses the Samsung Patent On The Fly identification method and the double cantilever structure to achieve the chip component 42,000 CPH and

KingFei SMT Tech

Assembleon Topaz

Assembleon Topaz

Used SMT Equipment | Pick and Place/Feeders

Optimal placement rate: 14,000 cph Simultaneous pick Nominal placement rate: 9,000 - 11,000 cph Component Ranges: 0402 - SOP, SOJ, PLCC, QFP 25 X 25 mm QFP 21 mm (0.83") with pin pitch down to 0.65 mm (25 mil) Line sensor camera system QFP 32 mm (1.

World Equipment Source / R1 Source, Inc.

Saki BF18D

Saki BF18D

Used SMT Equipment | AOI / Automated Optical Inspection

SAKI Desktop AOI BF18D-P40 Inspection Machine Substrate flatness: ±2mm Board size:50 * 60 - 250 * 330mm PCB thickness: 0.6mm - 2.5mm weight::30KG ■ Industry-Leading High Throughput Leading High Throughput The Alternate Color Digital Scanning

smtXtra

Test Research (TRI) TRI TR7700SIII Plus 2D In-line Automated Optical Inspection PCB AOI MACHINE

Test Research (TRI) TRI TR7700SIII Plus 2D In-line Automated Optical Inspection PCB AOI MACHINE

Used SMT Equipment | AOI / Automated Optical Inspection

Product description: Optical System Imaging Method Dynamic Imaging Top Camera 4 Mpix Angle Camera N/A Imaging Resolution 10 µm, 15 µm (factory setting) Lighting Multi-phase RGB+W LED 3D Technology Single/Dual 3D laser sensors (opti

Goldland Electronic Technology Company Limited

Test Research (TRI) TRI TR7700 SIIIPlus 2D AOI

Test Research (TRI) TRI TR7700 SIIIPlus 2D AOI

Used SMT Equipment | AOI / Automated Optical Inspection

Product description: Optical System Imaging Method Dynamic Imaging Top Camera 4 Mpix Angle Camera N/A Imaging Resolution 10 µm, 15 µm (factory setting) Lighting Multi-phase RGB+W LED 3D Technology Single/Dual 3D laser sensors (opti

Goldland Electronic Technology Company Limited

Test Research (TRI) TRI TR7700SIII 2D AOI-1

Test Research (TRI) TRI TR7700SIII 2D AOI-1

Used SMT Equipment | AOI / Automated Optical Inspection

Product description: Optical System Imaging Method Dynamic Imaging Top Camera 4 Mpix Angle Camera N/A Imaging Resolution 10 µm, 15 µm (factory setting) Lighting Multi-phase RGB+W LED 3D Technology Single/Dual 3D laser sensors (opti

Goldland Electronic Technology Company Limited

Vi Technology 3D XPi 400L

Vi Technology 3D XPi 400L

Used SMT Equipment | Visual Inspection

Make: VI Technolgoies Model: 3D XPi 400L Solder Paste Inspection Vintage: 2008 Details: 1. FAHP (flying absolute height profilometry) measurement method 2. Dual light source and on the fly image scan 3. High power M/H light 3D sensor 4. Shadow

Lewis & Clark

PARMI PARMI   SPI SPIHS60 MACHINE

PARMI PARMI SPI SPIHS60 MACHINE

Used SMT Equipment | SPI / Solder Paste Inspection

PARMI/SPI SPIHS60 MACHINE PARMI HS60 (supreme) solder paste thickness tester SPI The SPI HS60 (supreme) series is the next generation fastest online solder paste inspection system on the market. The measurement speed at a resolution of 13x13um is

Qinyi Electronics Co.,Ltd

Test Research (TRI) TRI TR7700SIII 3D In-line Automated Optical Inspection PCB AOI MACHINE

Test Research (TRI) TRI TR7700SIII 3D In-line Automated Optical Inspection PCB AOI MACHINE

Used SMT Equipment | AOI / Automated Optical Inspection

Product description: Optical System Imaging Method Dynamic Imaging with true 3D profile measurement Top Camera 4 Mpix Angle Camera N/A Imaging Resolution 10 µm, 15 µm (factory setting) Lighting Multi-phase RGB+W LED 3D Technology S

Goldland Electronic Technology Company Limited

Test Research (TRI) TRI TR7700SIII 3D AOI

Test Research (TRI) TRI TR7700SIII 3D AOI

Used SMT Equipment | AOI / Automated Optical Inspection

Product description: Optical System Imaging Method Dynamic Imaging with true 3D profile measurement Top Camera 4 Mpix Angle Camera N/A Imaging Resolution 10 µm, 15 µm (factory setting) Lighting Multi-phase RGB+W LED 3D Technology S

Goldland Electronic Technology Company Limited

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