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Aug 31, 2017 | Suppplier of Immersion Tin plating solution in North America Thank you Amalia for your reply but we are not looking any metals for pcb, we are looking specially Tin plating solution for plating purpose. If you do carry this please give your contact info. Regards, Hetal
Aug 3, 2017 | Suppplier of Immersion Tin plating solution in North America
Aug 3, 2017 |
Suppplier of Immersion Tin plating solution in North America Try:
* RD Chemical [ http://rdchem.com/chemposit-sn-rd-51.html ]
* MacDermid [ http://electronics.macdermidenthone.com/products-and-applications/printed-circuit-board/final-finishes/immersion-tin/ ]
* Technic [ https://www.technic.com/applications/pcb/chemistry/final-finishes-2016 ]
* MG Chemicals [
Apr 29, 2015 |
I have experience of Immersion silver and it's even more sensitive for all disadvantages mentioned above than Immersion tin. You can not go wrong with ENIG. It's little more expensive but in the end you save some bucks when you don't have to rework or scrap boards.
Apr 29, 2015 | I have experience of Immersion silver and it's even more sensitive for all disadvantages mentioned above than Immersion tin. You can not go wrong with ENIG. It's little more expensive but in the end you save some bucks when you don't have to rework or scrap boards.
Apr 27, 2015 | finish" blocks corrosive element in the environment At the end of the day, ENIG is a good choise of Electroless Nickel Immersion Gold (ENIG, ENEPIG) Immersion Silver, Immersion Tin and Organic Solderabilty Preservatives OSP
Jun 2, 2014 | I believe that you get better responses when you start a new thread, but that's just an opinion, not
Jun 2, 2014 | I've never heard of anyone affected by thiourea during assembly soldering operations. I believe the
Jun 1, 2014 | Thiourea exposure in manual soldering of immersion tin PCBs Thank you for your reply davef. Although the US restriction, I think that there are plenty of users of immersion tin in Americas, mainly low-volume fabs that do not plan to outsource finishing, or do not plan or can not invest in a HASL. If we restrict use of all hazard potential chemicals, we volatiles released with heating from soldering iron in manual soldering assembly of immersion tin plated PCBs? Thank you very much. Regards.
Jun 16, 2011 | The finish looks like Immersion Tin or Silver. if its lead free Hot air - could be issue of to high of a Tin Content. find out what brand of Hasl they are using. SL100 Example. Is this tarnished look only being seen after assembly or have you seen it before assembly to. I would send the pictures to you board house and see what ideas they have. If nothing else have them send you some samples of this board with an alternet finish and see if you have the same issues. I would recommend Enig. Looks to me like a Tin issue. Regards, BoardHouse
Jul 6, 2010 | What type of finish are the PCB's? HASL, tin immersion, silver immersion,........we've seen all the above problems with HASL finished boards. Usually either reheating w/ a soldering iron or "burnishing" with a scotch brite pad has worked for us.
Apr 15, 2010 | Will this work for Tin Immersion plating or does anyone have suggestions on what will work?
Sep 17, 2009 | The colour you see on the pads is tin/copper intermetallic layer. In your reflow the immersion tin coating and the copper pad underneath react to form in intermetalic layer. The effect is worse the hotter the pcb or area of the pcb gets. In IR reflow there will be quite a variation in the temps across your pcb so that is why the effect is in different parts of the pcb. You'll also find it's not as solderable as the original pads were. Keeping the pcb peak temp. between 230~240 will be better then 250 but it will still happen. This is an inherent problem with immersion tin coating.
Sep 16, 2009 | PCB finishing is immersion white tin. The brownish is at random location at PCB pad. The issue only affect visual reject but no solderbility functional failure.
Nov 12, 2008 | Are there better options? Dude, EVERYTHING else is a better option. Gluing aluminum foil down to the bare copper would be a better option. ENIG (Electroless Nickel Immersion Gold), Immersion Silver, Immersion Tin, and OSP all provide flatter surfaces then HASL. However, there's a cost impact
Aug 27, 2008 | We use immersion tin boards and ENIG with Sn63Pb37 with no problems. We did have to tweak the profile higher with ImmSn though.
Jul 15, 2008 | Hi Aj, Recommended Immersion gold thickness would be 3-5 Micro inches over 140 -200 micro inches of Nickel. Thicker Immersion gold than 5 micro inches can cause solder joint embrittlement. Gold readily dissolves in molten solder and will be present in the reflowed solder joint. Intermetallic gold-tin
Jul 28, 2007 | silver ALL are subject to corrosion in Battelle Class 3 environments (creep corrosion and/or fiber assisted electrochemical migration, blistering/peeling of conductive corrosion products, etc.) * Only SnPb HASL and immersion tin survive this environment ** SnPb HASL is not Pb-free ** Immersion tin has whisker risk - worse than immersion tin ** Cu dissolution ** Process control at fabricator ** Etc. NO PATH FORWARD at this Time! There is no good choice. Board Finishes: Industrial/Battelle Class 3 Environment [Reliability Knowledge Gaps: For use of Pb-free solders in High Reliability Applications, J Smetana, iNEMI Availability of SnPb-Compatible BGAs Workshop, March 1, 2007, Alcatel-Lucent]: * ENIG, OSP, and immersion
Jul 27, 2007 | Our preference has been ENIG. We find that we achieve higher quality (visually) soldering for through hole and surface mount parts, with less handling issues than when we use white-tin, or immersion tin. We are about to do a test on some boards that have lead-free HASL. I'm hoping
Jul 6, 2007 | What's the metallization on the board? We use an immersion tin board and had to increase our profile to successfully solder.
May 18, 2007 | Immersion White Tin Thank you for all your help. I help all my customers to understand more about the production of their parts. I even build free parts using 3-4 different finishes so they can evaluate the parts. In working with CM's many of them are always asking us to make the switch from Immersion white tin to ENIG, but when you have a customer that is accustomed to using white tin on all their parts, what could you do. Our CM lost out on many of their projects to another CM that has no problem assembling with white tin. I just don't think that when a customer asks for a certain finish, I myself
May 16, 2007 | "twitchy"? I thought we were incompetent arse holes?
May 15, 2007 | Immersion White Tin as we expected, then it's up to you to help us make it work. Contact Steve Wentz or whoevah at your supplier and get them to help you. We prefer immersion silver for 20 thou pitch and lower. ENIG is too risky, because fabs and their suppliers don't know how to turn it on and to turn it off.
May 14, 2007 | Immersion White Tin have converted our White Tin products over to Immersion Silver. Although some suppliers had consistently good product, we did not want to spend any additional time testing all of them. The switch to ImmAg was easier. Solderability!!! The CM in question has probably seen too many solder problems with White Tin in the past. We have had the same issues. To save us from spending too much time and money(verifying pure Tin plating thickness, Chemical leaching from the solder mask, improper storage and handling), we
May 10, 2007 | personal experience, and your mileage may vary. However, we found that white-tin finishes resulted in a very large quantity of voids/blow-holes during wave soldering. Gold immersion finishes did not exhibit these issues. 2. Better over-all processing. While white-tin is cheaper, we found that the issues related with keeping the finish clean for manufacturing out weighed the cost increase of gold immersion. We were cleaning all white-tin assemblies with alchohol prior to each paste application, just to keep ahead of the poor-solder issues we encountered when we didn't clean them. 3. Better Pros/Cons of Gold immersion boards(solderability)
Feb 23, 2007 | Many thanks, DaveF I learn something new every day. Sincerely,
Feb 16, 2007 | IPC-4554 Specification for Immersion Tin Plating for Printed Circuit Boards
Feb 16, 2007 | Good afternoon, Typical plating thickness for immersion tin is 0.6-1.0um. I do not know what the maximal thickness is. But plating is self-limiting process and I believe maximal thickness should be about 2-3um. BR, Pavel
Aug 15, 2006 | Bake your solder mask and then solder coat. If you are going to put an immersion finish like Osp, gold, tin or silver you would have to do a Micro etch to clean the copper prior to placing the surface finish. Regards, Board House
Aug 7, 2006 | Pcb immersion tin thickness . I did not have a sufficient tin layer 14 micron. What would be the recommended thickness of immersion tin for a pcb for at least three heat passes ??? Thanks for taking time to answer!!!!! Hi everyone, I am starting to use the lead free process and I had a few wetting problems (solder did not reach top side) at the wave soldering process once the pcb had passed our smt line (one heat pass). From what I understand, I have had a problem with the thickness of the tin layer on the pcb
Apr 20, 2006 | Immersion Tin Hi, I'm just wondering if someone have more information about board with immersion tin plating. I search in the archive but didn't find anything interesting. We try it, and we have difficulties to make a good solder joint with the wave. And with the reflow profile the joint seem dull and don
Dec 16, 2005 | Thanks for your response.
Dec 16, 2005 | Thanks for your response.
Dec 16, 2005 | Immersion white tin wave soldering problem Heat cycles deplete the pure tin layer. Each solder cycle reduces the tin thickness by ~0.1 micron (4 uin). So, if you start with a thin imm tin coating you'll have problems after multiple heat cycles. Steve Wentz says, "In almost every case I've seen, when the first pass or two solders fine and then problems arise, it is an insufficient thickness of white tin that was on the board." There are at least two major imm tin technologies out there. Each has different plating thickness. Your board fabricator should be able to satisfy you that proper controls are maintained to ensure adequate plating
Dec 12, 2005 | Propensity of Immersion Tin surface finish fo whiskers do you intend to use Immersion tin as a PCB surface finish ? Then Whisker concern is as below if you do not past your test pads, the pads will be stressed when probed on a ICT or a flying probe tester. This is a POTENTIAL for whiskers There is a lot of general whisker debate published
Dec 12, 2005 | Propensity of Immersion Tin surface finish fo whiskers thank you devef....My point is this....If you solder all the areas that have Imm Sn on them, there wont be any whisker formation DUE TO THE IMM TIN COATING.....whiskers could still potentially form as a result of COMPONENT FINISHES and effective mitigation would then lie in the realm of component
Dec 9, 2005 | Propensity of Immersion Tin surface finish for whiskers
Dec 8, 2005 | Propensity of Immersion Tin surface finish fo whiskers during my researches for LF transition, a question being asked is -- why even consider immersion tin if it whiskers. does it really matter?, because during reflow, the Sn dissolves in the SAC solder alloy and does not exist in a "Sn whisker" formable form for a lack of suitable term. the real
Oct 25, 2005 | Could you be talking about immersion tin?
Sep 20, 2005 | Ok sounds like it is very mush devised by the type of technology and also cost. The boards are double sided telecoms boards with immersion tin finish and very complex (Multi-Layer, 0.4mm QFP, pressfit, double sided BGA's, >$1500 each
Sep 8, 2005 | but without satisfactory results. Probably have a noise factors. Component is connector with 10 pins Tin finishing and PCB is immersion TIN. Alloy is SAC305 and flux KESTER - VOC free and Alcohol both capable for lead free process. See http://mail.dir.bg/~lmr/166XX_1.JPG I suppose that the reason is the higher thermal mass of the connector and non-good wetting property of immersion TIN PCB after SMD i.e. have a oxidation. If anyone be faced with this issue I will be grateful to know what can be the solution. Thank you
Aug 26, 2005 | Immersion gold and BGAs Where could I find more information regarding the double sided reflow and flux problems with white tin?
Aug 26, 2005 | I have heard that there are problems using immersion gold on PCBs when working with BGAs. Is this correct? Is white tin more suitable? Immersion gold and BGAs
Jul 15, 2005 | of solderability protection that we see are: * Hot Air Solder Leveled [HASL} * Electroless Nickel / Immersion Gold [ENIG] * Organic Solderability Protection [OSP] * Immersion tin * Immersion silver The latter three are proprietary processes. We can give you contacts if you'd like. HASL and ENIG have been
Jun 16, 2005 | Doug: While your points are well taken, we've never heard of "bright tin" immersion plating. Electroplating is our bet.
Mar 24, 2005 | There's a lot of comparison tables on the web. Here's one: Properties - Summary [A Winlow Circatex] Attribute||Hasl||Immersion Silver||Immersion Tin||Electroless Pd||OSP||Eless Ni / Imm Au Shelf Life (months)||12||12||12||12||12||6 Multiple Reflows||4||5||5||5||4+||4 Cost Reflow Profile ENIG Vs. Immersion Ag
Mar 5, 2005 | the thickness (results were it was under spec)...we've since scratched the pcb supplier from our vendor list. I agree with dave, immersion silver might be a better way to go given the immersion tin limitations on number of heat cycles directly related to finish thickness. Gus White tin pcb, smt production
Apr 20, 2004 | Immersion Silver Reliability ImAg is the Surface finish of choice for Intel mother boards....Tin/lead and lead free processes. I think palladium and soft gold are the preferred for wire bondable apps.
Dec 22, 2003 | I have seen this affect on Immersion Tin and OSP. 70 to 90 % of the solder wicks to the lead and forms a "single" homogenous solder mass. This even though the pad was 100 % covered with paste... Evaluated different solder paste...did find variations on a theme...not all paste is created equal ! Can't give much away on this...you'll understand. Currently not treating this as a defective situation. Wetting spread is poor with High Tin solders anyways... Excellent evidence of wetting. Intermetallic was formed. toe & heel fillet & side fillet I have seen this affect recently on Immersion Silver with Tin-Lead solder...can be simulated with poor anti-oxident in the silver bath. However, no evidence of de-wetting was noted Cross section a sample board. You will see exactly what I'm talking about.
Oct 8, 2003 | Hi Dave: Thanking in advance for your valuable response!