Electronics Forum: immersion and silver and tarnish (Page 1 of 1)

Immersion gold and BGAs

Electronics Forum | Fri Aug 26 09:57:21 EDT 2005 | russ

The Immersion gold is not a problem with BGAs specifically but "black pad" which can be present anywhere. The unfortunate thing with BGAs is you cannot see it. Personally I hate white tin. It is okay for single sided boards running no-clean, but c

Imm Silver and Voiding

Electronics Forum | Mon Jun 26 08:08:32 EDT 2006 | davef

It does make you think the immersion coating is causing the voiding, doesn't it? We never have seen that.

SN100C alloy positive and negatives

Electronics Forum | Wed Dec 24 15:28:17 EST 2008 | edmentzer

We use SN100C for wave soldering and hand Lead free soldering and have had very good results. The wire cored solder for hand soldering flows good and makes very good solder joints. The SN100C in the wave solder machine also works very good. We use

Re: CuOSP and IMM Silver versus HASL

Electronics Forum | Thu Aug 31 18:59:55 EDT 2000 | Brian W.

Our customers use OSP, HASL, immersion tin and immersion gold as board finishes. If I recommend a finish to the customer, it is one of the immersion finishes or OSP. Those finishes have the advantage of a flat surface to deposit paste. HASL has va

CuOSP and IMM Silver versus HASL

Electronics Forum | Thu Aug 31 12:17:56 EDT 2000 | mike weekes

We are considering alternative Board Finishes to our existing HASL process. The HASL effects opens on 25 and 20 mil packages after reflow and we know if the advantages of CuOSP and other alternatives. OUR Concern: Is there a shelf life and handlin

Criteria for Min Thickness regarding Large and Small pads

Electronics Forum | Sun Jun 29 15:03:04 EDT 2008 | jensteele

I was referring to the HASL supplied by the supplier...specifically Lead Free HASL. I've been searching the web and I cannot find a thickness specification like we have for ENIG and Immersion Silver.

what is the different between ENIG and Immersion Au

Electronics Forum | Thu Jan 12 10:05:13 EST 2006 | davef

There's a lots comparisons like this on the web. Here's one: Westwood Associates said on 8/12/2003: HASL OSP ENIG Pd Tin Silver Flat no yes yes yes yes yes Solderjoint Cu-Sn Cu-Sn Ni-Sn Ni-Sn Cu-Sn Cu-Sn Contact E-test, ICT no

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