Electronics Forum: immersion and tin (Page 1 of 37)

About immersion tin

Electronics Forum | Mon Oct 06 09:55:35 EDT 2003 | davef

While you are waiting for others to reply, search the fine SMTnet Archives on: * immersion and tin * imm and tin

About immersion tin

Electronics Forum | Sun Oct 05 06:37:41 EDT 2003 | christ

Hi all: I want to know the parameter and criterion about the process of immersion tin,could you be kindly to give me the hins about it in more detail.Thank you for your support. Best wishes christ

About immersion tin

Electronics Forum | Wed Oct 08 06:55:36 EDT 2003 | christ

Hi Dave: Thanking in advance for your valuable response!

Pcb immersion tin thickness

Electronics Forum | Wed Aug 09 08:06:07 EDT 2006 | davef

See "IPC-4554 Specification for Immersion Tin Plating for Printed Circuit Boards" 3.2.1 Immersion Tin Thickness. The most common reason for solderability issues with the white tin surface coating during multiple thermal excursions is a thin white ti

Pcb immersion tin thickness

Electronics Forum | Mon Aug 07 09:04:09 EDT 2006 | molos21

Hi everyone, I am starting to use the lead free process and I had a few wetting problems (solder did not reach top side) at the wave soldering process once the pcb had passed our smt line (one heat pass). From what I understand, I have had a problem

White tin immersion finish

Electronics Forum | Wed Jul 29 13:44:45 EDT 1998 | David Spilker

We are investigating alternatives to HASL finishes for more dense PWBs. OSP is not a good choice because of low solid flux and possibly long shelf life. Immersion gold is expensive and so far has been more difficult to wave solder. Has anyone had

Re: White tin immersion finish

Electronics Forum | Mon Aug 03 12:18:42 EDT 1998 | John Sikes

We have mixed to negative feelings about Omikron, but I beileve it is due to problems with the board fabricator rather than the process itself. When done properly, our Omikron boards have had very good solderability. However, we have had several ru

Re: White tin immersion finish

Electronics Forum | Wed Aug 05 07:46:46 EDT 1998 | Earl Moon

We have mixed to negative feelings about Omikron, but I beileve it is due to problems with the board fabricator rather than the process itself. When done properly, our Omikron boards have had very good solderability. However, we have had several

Qualification requirements for immersion tin finish

Electronics Forum | Wed Aug 30 19:59:45 EDT 2006 | davef

IPC-4554 - Specification for Immersion Tin Plating for Printed Circuit Boards

Qualification requirements for immersion tin finish

Electronics Forum | Wed Aug 30 08:20:40 EDT 2006 | Bob R.

Are there any standard qualification/acceptance requirements for immersion tin board finish? J-STD-003 calls out temp/humidity preconditioning followed by solderability testing which is similar to what we have in our (ancient) internal documents. O

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