Electronics Forum: impurities bond (Page 1 of 1)

About the PCB gold finger contamination.

Electronics Forum | Thu Sep 19 17:14:02 EDT 2002 | davef

Comments are: * Use an eraser if the surface of Au is not clean, but make sure the eraser has no/low ionics (such as sulfur that is a common additive for rubber). * If the plating surface required eraser to remove the top surface, the plasma normally

Gold surface contam after prebake 150C for 3 hrs

Electronics Forum | Wed Apr 07 22:15:31 EDT 2004 | davef

We're not familiar with the AUG5 from Taiyo. [It doesn't show on their US site.] Is it liquid photoimageable? Printed solder masks are more likely to bleed. But you wouldn't have any solderability with bleed. Your plating seems acceptable [if th

aluminium wire bonding on Electroless Nickel + Immersion gold

Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef

This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R

  1  

impurities bond searches for Companies, Equipment, Machines, Suppliers & Information