Electronics Forum | Wed May 28 12:31:18 EDT 2003 | larryk
This is our first experience with running embedded flexs. Our board supplier suggested that we prebake our assemblies before placing components. What does everyone else do? Is prebaking normal when a flex is embedded?
Electronics Forum | Thu May 29 10:05:10 EDT 2003 | swagner
I hate to answer a question with a question but what are the particular effects of moisture absorption in a flex circuit?
Electronics Forum | Thu May 29 14:27:04 EDT 2003 | larryk
This flex is .001" Kapton polyimide. The flex portion of this rigid flex consists of 3 layers of 1 oz copper with 5 layers of Kapton. Part of the flex is sandwiched in standard FR4 with two layer of copper on each side for a finished thickness of .
Electronics Forum | Thu May 29 09:33:03 EDT 2003 | swagner
Phil, is this a post or pre reflow application, it makes a big difference on how you collect and use the data.
Electronics Forum | Thu May 29 14:03:54 EDT 2003 | testing
Hi swagner, I am collecting from both Post and pre reflow applications. Any help would be much appreciated, thanks again. Regards Phil (QA)
Electronics Forum | Thu May 29 16:14:34 EDT 2003 | steves
What is the general feeling in the industry on the use of 15.7 mil QFP's? Are most people shying away from them in favor of BGA or do most people consider 15.7 mil to be "standard" technology these days? What special considerations are involved? Ste
Electronics Forum | Thu May 29 16:29:09 EDT 2003 | swagner
I do not recommend using a HASL finish, you will have a very tough time printing repeatably.
Electronics Forum | Mon Jun 02 04:17:39 EDT 2003 | emeto
Hi Steve, Why are you so concerned about QFP(0.4) or BGA? If your equipment can manage, what's the difference? If you are designer do it better and use the cheaper or smaller package(you decide). If not use machine with vision recognition and your pr
Electronics Forum | Mon Jun 02 09:38:12 EDT 2003 | pjc
yo Evt, ".., what's the difference?". Answer: Huuuge!! between running 0.4mm pitch QFP and a BGA of same I/O, in terms of handling, storage, feeding (trays), p&p, inspection, test, rework, etc.......
Electronics Forum | Thu May 29 16:04:08 EDT 2003 | Rick B.
When is the U.S. required to fully implement the use of leadfree solder? European Directive 2002/95/EC is talking about year 2006 restricting the use of certain hazardous materials in electrical and electronic equipment.ie Lead,mercury,cadmium and he
