Electronics Forum: index (Page 2676 of 7889)

Land Grid Array (LGA) Rework

Electronics Forum | Tue Sep 09 14:49:13 EDT 2008 | ksrsr

We get our component stencil for this type of rework from Mini-Micro Stencils. We use a Air-Vac rework station and we have no issues at all.

problem in solderability

Electronics Forum | Wed Aug 27 10:35:04 EDT 2008 | evtimov

Hi, also you can check the board design. If always the sme pins are not soldered, a via could be close to the pin and take part of the solder in. Regards, Emil

problem in solderability

Electronics Forum | Wed Aug 27 17:21:28 EDT 2008 | vladig

Soory, but I don't understand what you are saying/asking. Parts with Pb-free finish existed in the Pb-Sn world, so what is so special about your QFPs? Vlad www.sentec.ca

problem in solderability

Electronics Forum | Wed Aug 27 23:00:55 EDT 2008 | omid_juve

i mean that the parts that we have here is ROHS compliant(pb free)but the process that we have(the type of solder paste & the surface finish of the board has pb in its mixture) this is not the cause of problem ?

problem in solderability

Electronics Forum | Thu Aug 28 13:15:59 EDT 2008 | omid_juve

how can i be sure that the device isn`t affected by moisture ? i mean that if the pins are oxidized due to the moisture how can i remove this oxidization ?

problem in solderability

Electronics Forum | Thu Aug 28 15:30:56 EDT 2008 | vladig

We do it on a regular base. You can check out the website below (we are still working on it, though). Regards, Vlad www.sentec.ca

problem in solderability

Electronics Forum | Fri Aug 29 02:47:31 EDT 2008 | omid_juve

i read in smt soldering handbook that by placing the device in a 125`c within 48 hours the moisture will be removed what do you think about this method ?

problem in solderability

Electronics Forum | Fri Aug 29 07:56:56 EDT 2008 | davef

Omid It depends. Follow the guidelines of ANSI/J-STD-033, Standard for Handling, Packing, Shipping, and Use of Moisture/Reflow Sensitive Surface Mount Devices. It's available on-line.

problem in solderability

Electronics Forum | Mon Sep 01 02:24:10 EDT 2008 | omid_juve

we use another device with the same package but it doesn`t have any solderability problem . the things that we are hesitate on is the difference between the pin alloy in these two different packages . also i should say that in rework station it will

problem in solderability

Electronics Forum | Tue Sep 02 12:43:12 EDT 2008 | stepheniii

That could lead to oxidation of the leads and worsen solderability. It's much better to make sure the components are handled properly and not exposed to moisture. The reason for baking is moisture in the body not in the leads. Why is no one suggest


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