Electronics Forum | Thu Aug 20 07:10:46 EDT 2009 | davef
Questions are: * On what portion of the second side of the board [eg, solder only, solder mask only, etc] do you see this white hazy residue? * Could you attach a picture? * You mention cleaning this residue. What have you used to clean the residue?
Electronics Forum | Thu Aug 20 08:24:07 EDT 2009 | padawanlinuxero
Hi ! In both solder mask and solder joint, I am going to upload a picture today promise, I use only IPA and a ESD brush this kinda clean the problem
Electronics Forum | Thu Aug 20 08:42:32 EDT 2009 | voytek
Do you know if I can use Multi Pitch Tape Feeder from GSM2 platform on GSM and GSM1 platform? Thank you,
Electronics Forum | Fri Aug 21 11:00:48 EDT 2009 | boardhouse
Edoardo, if your going to try to push your book, why don't you disclose that the web site your pushing is yours. Boardhouse
Electronics Forum | Fri Aug 21 13:58:21 EDT 2009 | ghepo
Dear Mike, because that site and handbooks are property of many hands and because I work in a multinational company as manager of a PCB quality dept. Therefore, be mistaken for a "guru" in this major website, is not my purpose. Anyway, thanks for y
Electronics Forum | Sat Aug 22 09:37:54 EDT 2009 | davef
This gives a different view: http://www.globalsmt.net/regions/mexico/content/view/1184/106/
Electronics Forum | Sat Aug 29 18:12:25 EDT 2009 | gsala
V-Score, few interesting references http://www.vscore.biz/vsguide.html http://coretec-inc.org/files/Technology_Center/Scoring_Process.pdf regards
Electronics Forum | Fri Aug 21 11:48:14 EDT 2009 | dcell_1t
thanks davef according with DOE, most significant factor was the placement force applied to component... just to wait for confirmation run!!! regards.
Electronics Forum | Mon Aug 24 19:08:28 EDT 2009 | rossi
Thank You for all your help. The PCBs are from the same vendor. You mention the tape test. How exactly do we perform this test? Eric
Electronics Forum | Tue Aug 25 13:30:35 EDT 2009 | rossi
It appears that the crack is between the paste and the ball. We physically pulled off the BGA by force and almost all the balls broke at the PCB. There was a thin layer of solder left on the pad. Maybe 1% of the balls stuck to the pad. I have attac
