Electronics Forum | Mon Jul 01 21:35:45 EDT 2002 | jersbo
Would rather have lower humidity and strict ESD rules in place.. than a high humidity condition anyday.. High humidity- 45RH + Paste depending on what you use may become an issue.. Components are sensitive... ever get that vacuum sealed bag you dont
Electronics Forum | Mon Jun 17 13:07:11 EDT 2002 | Robert Hartmann
Can anyone point me to a specification or paper describing the existance of voids in transfer mold epoxies during CSP assembly? We have found very small bubbles in our process, but cannot find any information as to whether this is acceptable, and if
Electronics Forum | Mon Jun 17 21:31:23 EDT 2002 | davef
Most of our discussions here on SMTnet have focused on underfills. With transfer molding, voiding near the die, wire bonds, or leads contribute to more failures than others. Try: * Tim Chen, Cookson Semiconductor 800-223-9057 * Ron Molnar, Abpac In
Electronics Forum | Mon Jul 01 21:55:59 EDT 2002 | Gang shen
oh,sorry,my expresion is not clear.the problem is that about one sixties of BGA is deviation from the proper position one line. my place machine is IP3,the part data of the BGA is okay(in my opinion),our "test vehicle" is poor just by human eyes,with
Electronics Forum | Tue Jun 18 20:14:14 EDT 2002 | mantis
Well if the Part Data isint correct then your placement position wont be right especially if there odd for connectors.You should examine the image on the ip3 and determine wether the machine has found the centre of the part.Also u might want to check
Electronics Forum | Tue Jul 02 14:45:20 EDT 2002 | bentzen
Hi Greg. As a subcontractor, not able to control the part design, you are in trouble. I�m not sure, but maybe use of the graphical shape library could be a solution. This library can be used to ensure correct zero degree rotation and it migth be p
Electronics Forum | Wed Jul 03 15:44:30 EDT 2002 | mantis
If the designer has used pin one as origin surely all parts on the board would have pin one as orign and all parts would be off be same amonunt.If u like you can send a copy of your PD and i would be happy to review it for you and see if theres anyth
Electronics Forum | Wed Jun 19 05:16:21 EDT 2002 | hany_khoga
Dear all: I wonder how to avoid cracking the BGA if I want to remove it from the PCB assembly, re-ball it and solder it again. I need an answer considering: 1- The assembly could have been exposed to the ambient humidity for a long time. 2- The as
Electronics Forum | Wed Jun 19 08:51:49 EDT 2002 | davef
Try this: * Remove PTH components that cannot resist baking like, plastic sockets & electrolytic capacitors. [NOTE: It may be econonomic to sacrifice some of the PTH components that cannot resist baking.] * Bake the board. * Remove, reball, and repla
Electronics Forum | Mon Jan 26 09:44:13 EST 2004 | Dave Chapman
Dave , I am working with a West coast Liquidator, Which has a very good condition Amistar 1998 MT 5530LQ S/N 13908-87162 , Machine has 50 feeders 80 percent are 8mm balance are 12,&16's Has lazer centering , fiducial camera, and upward looking
