Electronics Forum | Wed Feb 07 07:36:11 EST 2007 | jax
mk, Should I read into the fact that you posted this on a sipad website? You could always add an etch process to you stencil design to gasket around the raised mask locations. It is currently done when additive etch's/trace's are used. The extra $20
Electronics Forum | Wed Feb 07 13:43:33 EST 2007 | realchunks
Board vendors are always right. Unless you build yourself in their facility, at their price. Ways around this are half etch your stencil over the vias, open the resist (mask) on the vias, or use your own product (Sipad). The resist (mask) does app
Electronics Forum | Fri Feb 09 07:51:09 EST 2007 | jax
If the attack was unwarranted I apologize. I still stick to my answer. Unless the board shop can get rid of it you have to find a way to deal with it. Etching trace paths into the stencils is inexpensive and works just fine. If you do not have the ti
Electronics Forum | Tue Feb 20 13:24:35 EST 2007 | Wave Master Larry
LISTEN i know its been awhile but i'm back.just got back from consulting in China. i tell ya them Chinese realy have there acts together. anyway ive recently been consulting for SMTA as well. you see here i am posting from thier address.i'm pretty ti
Electronics Forum | Fri Feb 09 17:09:29 EST 2007 | flipit
I think it depends on the shield and how it is configured. If your shield has some openings and your placement process is good, you can try it and see how it goes. I place small shields on small PCBs (1" X 2") and have no problems. There are 20 mi
Electronics Forum | Thu Feb 08 14:55:30 EST 2007 | pavel_murtishev
Good evening, I do. 2mil overprint is not critical. Paste will simply flow back. Paste flows back even with larger overprint (up to 15mil at least). 5mil stencil thickness if fine also. BGA area ratio for both BGAs is higher than 0.66 required by IP
Electronics Forum | Mon Feb 12 10:27:33 EST 2007 | muse95
Tha type of stuff (distorted words, email address verification) possibly stops automatic computer generated spam, but as explained to me on another forum, even with those registration steps in place, there are real people out there that are paid for
Electronics Forum | Fri Feb 09 01:41:46 EST 2007 | Muhammad Haris
CHECKS FIRST that your BGA doesn't tilt from pick & place machine. SECOND lead free paste have some problem that it solder the component whereever pick&place put the component while solder pastes having lead, put the component on its PCB pad like a
Electronics Forum | Mon Feb 12 01:19:27 EST 2007 | Wayne
the center part of the BGA balls may not fully reflow or melt and cause BGA tilt, not functioning working (only press then work) and etc..... the simple way to solve this issue is to use low temperature solder paste, it can melt in between 220 to 225
Electronics Forum | Fri Feb 09 02:41:12 EST 2007 | Muhammad Haris
1. Can X-Ray Inspection System damage the EPROM OR OTP during inspection after Reflow? 2. At 300 degree Centigrade, program in the EPROM OR OTP disturb. Is that true? 3. Sometimes, if some ICs couldn�t program first time then I put that IC in oven
