Electronics Forum | Thu Apr 12 20:27:28 EDT 2007 | stimpk
What is part vendor? Can you look that up and determine supply type etc tape/reel/bulk etc... Does it have a design/surface that a SMT nozzle can consistantly pick from? We place thousands of differents clips with ease. If your part can be picked and
Electronics Forum | Wed Apr 11 20:49:39 EDT 2007 | raychamp007
3W. Figure 8-84 shown evidence of heel bend wetting(but no written criteria mention about the solder fillet must present at the heel bend). It is acceptable if the minimum D(3W/75%L)extend from toe which is no evidence of solder fillet at heel bend?
Electronics Forum | Thu Apr 12 20:32:31 EDT 2007 | davef
On one hand, nothing in 8.2.5.4 that states that you need a heel fillet. It only talks to the length of the side fillet. On the other hand, we suggest that you should use 8.2.5.6 to determine if your heel fillet is acceptable, after you have determ
Electronics Forum | Fri Apr 13 07:25:06 EDT 2007 | davef
Your paste should meet the mid-point of outside lead bend. If you cannot meet that, IPC-A-610D, 8.2.5.6 defines the minimum. We agree that it gets confusing when you post multiple threads on the same or very similar topic.
Electronics Forum | Thu Apr 12 00:56:20 EDT 2007 | Jani
Our SMT production and storage area is air-conditioned, constant temperature is maintained but the humidity is not controlled , the raw SMT material is stored in a "Drier" cabinet, but since we assemble hybrid SMT and thru-hole PCB assemblies, the SM
Electronics Forum | Sat Apr 21 16:16:15 EDT 2007 | GS
150 grams)on a very thik board (> 3,5 mm)( we did it by DRS-24). On top to this, in case of need you can use also hot N2 (Nitrogen)and get low ppm of O2, for instance when soldering on OSP finisching using NC paste, etc, if required. Regards...GS
Electronics Forum | Tue Apr 24 02:56:12 EDT 2007 | chrispy1963
If the PCB you are using is a HASL pad finish and is a leaded assembly, we use homeplate pads with a 5 mil stencil. If the circuit has Enig finish and is PB-Free then we use 1:1 apertures with a 5 mil stencil Either method should provide no solde
Electronics Forum | Thu Apr 12 17:34:05 EDT 2007 | carsan
We are running RoHS compliant & non RoHS compliant assemblies. We buy our bare boards from one supplier that only manufactures RoHS compliant boards using a Sn100 finish. Is there any known issues running leaded solder on a Tin finish? Does normal
Electronics Forum | Thu Apr 19 07:38:23 EDT 2007 | bartlozie
Only options we have (i think) is the Unders Screen cleaner unit. and the tooling carousel. (this you realy need, is the best board support system) 2D inspection (i don't know if this is realy a opion) I think 145K is a lot. You can get a better p
Electronics Forum | Fri Apr 13 09:41:41 EDT 2007 | aj
All, I have an intermittent faut with a 672 BGA where it fails in test but upon applying pressure to the BGA it works. Clearly there is an issue with the wetting of some Balls causing a poor connection. My profile looks spot on - I think I poste
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