Electronics Forum | Tue Feb 23 12:56:03 EST 2010 | vleasher
Is there any harm in washing SMT soldered with NoClean paste? The PCA has some large thru-hole connectors that we would prefer to do as water soluble on out selective solder but the SMT consists of LGA's and other low parts that we would not be able
Electronics Forum | Wed Feb 24 07:28:40 EST 2010 | drt
Agree with what has been said so far. Check with your end customer and make sure the white haze appearance of the board will be acceptable. You will never get the board to look like it did before you started. It may be clean but it won't look like t
Electronics Forum | Wed Feb 24 10:23:04 EST 2010 | xps
60° C). Moreover (by IPC standard)... "White residues resulting from no-clean or other processes are acceptable provided the residues from chemistries used have been qualified and documented as benign...". So, use an EDX or IC analysis in order to
Electronics Forum | Thu Feb 25 03:37:25 EST 2010 | xps
Sorry, but I don't know this brand. Anyway pay attention, because if the chemistry is resin based, is difficult to clean and the residuals may be hygroscopic. So, I only can suggest you to read the data sheet and follow the instructions by the solder
Electronics Forum | Thu Feb 25 15:24:58 EST 2010 | jdumont
We use the OM-5100 and wash it with relatively good results. Just dont let it sit longer than a few days before wash. We've used Zestron AC200 and A-250 in a batch cleaner set to 140 wash temp for 8-10 min @ the recommended concentrations. We have h
Electronics Forum | Wed Feb 24 15:00:41 EST 2010 | wrongway
We just stencil the part not the pads if you stencil both then you probaly have to much paste the QFN will lift becuse of the center pad. if the question is screen the part or the pad our boards have parts so close to the QFN that stenciling the pcb
Electronics Forum | Wed Feb 24 10:07:36 EST 2010 | aajmera
I am looking for some suitable SMT production performance metrics for a high mix, low volume setup. Currently we use CPH and Machine Utilization. However, in the process of catering to the HMLV setup, we have more changeovers and so the utilization a
Electronics Forum | Thu Mar 11 18:04:20 EST 2010 | dcell_1t
Currently we measure only in schedule attainment... based on Final Assembly requirements, how many boards were produced during the week. We're working on link Final assembly requirements to be able to produce "leaner" in smaller batches, but is a pai
Electronics Forum | Thu Feb 25 10:21:49 EST 2010 | jdumont
My guess would be that the adhesive used on the dots contains silicone. We use 1B73 which is also acrylic and it hates silicone. We use silicone RTV to permanently mask around some connectors and unless its fully cured before coating it will cause l
Electronics Forum | Thu Feb 25 10:54:03 EST 2010 | duanebrayton
We are a small Contract Manufacturer and have received a project which has BGA's on top & bottom. 2 larger BGA's on one side (~_20x20mm) & 3 smaller BGA's (~_8x8mm) on the other. we plan on running the side with the smaller BGA's first but need som
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