Electronics Forum | Fri Dec 02 22:51:23 EST 2016 | peteralmendrala
Hello, im using Siplace X2, i have problem im using inkspot. My inkspot is color black. When manually inspected to the machine it can detect correctly, but when i run it in auto, still the machine mount the component in a pcb that has a inkspot. Nee
Electronics Forum | Sat Dec 03 05:59:42 EST 2016 | sophyluo1985
Hello Peter, I'm sorry for that i can't solve the problem of your machine. But we can supply spare parts for Siemens/Siplace X feeders. Please kindly let us know if you need. Thanks a lot. Sophy Please note our websit http://feedersupplier.com/Catego
Electronics Forum | Mon Feb 20 04:57:51 EST 2017 | ariss_t
Hi Peter.. Pls make sure u tick the inkspot box inside the sipro.. when u do this pls make sure the cam cross bullseye really near the inkspot center point.. then u need to teach the good inkspot and bad inkspot.. seems like ur inkspot position offse
Electronics Forum | Wed Dec 07 09:20:27 EST 2016 | sumote
If you have some budget left over from buying the machine, contact the guys at Pentagon EMS. They build a bullet-proof wave pallet. They can make a board specific, for each assembly, or a generic-adjustable one that can be used for most boards. I can
Electronics Forum | Fri Dec 09 06:33:01 EST 2016 | cyber_wolf
Hold on Carlo, You are saying two different things, you are saying "(Zones 3,4,5,7 & even Cooling Zone). PV exceeds about 5-10 degrees with the SP. (ex: SP=140deg, actual PV = 145deg & higher). " Then you say: "the board reach up to 145 deg. 5 deg
Electronics Forum | Fri Dec 09 11:21:52 EST 2016 | ilavu
I have one GSM2 with Flexjet on both beam. I want to replace one beam with Flex head to get more flexibility. My machine is equip with ULC in both front and rear. Also, it is OS/2 with 4.5 software. I do have one working Flex head that can be use. I
Electronics Forum | Fri Dec 09 14:09:32 EST 2016 | sumote
Does anyone have a set of documents for this machine? I am having some difficulty getting my machine to work and could really use some documents. Specifically a users manual, Maintenance manual, and drawings/schematics would be helpful as well. Than
Electronics Forum | Wed Dec 14 12:34:56 EST 2016 | cy4223111
Hi all, Recently, we are trying to do wire bonding between a 75 * 75 um pad on a chip and substrate with 150 um height difference, but when completing wire bonding and the wire bonds on pad and substrate, the pad will get out of the chip easily
Electronics Forum | Wed Dec 14 20:17:48 EST 2016 | davef
As I understand, you are wire bond gold wire to gold pad, where the substrate has good bond strength, but the die does not. If bond quality is good, and then drops off rapidly, then it's probably something to do with contamination within the system
Electronics Forum | Mon Dec 19 07:55:30 EST 2016 | bk
I am assuming that these are the round aluminum electrolytic caps. The problem may be that they are too wide to put on 2 hydra heads next to each other. Plus the hydra heads are not that great at placing tall parts. I would not let the hydra place th
