Electronics Forum: index (Page 5201 of 7890)

Re: uBGA rework and X-Ray inspection

Electronics Forum | Sun Apr 16 14:37:25 EDT 2000 | Roberto Navarro

Hi, I work for Nortel and here rework BGA'S we use DRS22 rework station and CRT 2000 X-ray inspection. The main problem is put again the BGA on the PCB because you need reboling the PCB and you could damage the soldermask. Talking about Air-vac is ve

Moisture ingression on components

Electronics Forum | Thu Apr 13 05:13:22 EDT 2000 | C.Long

Anyone have any ideas as how to track the amount of air exposure to SRAMS etc as thay move from stores onto the production floor. i am looking for ideas as how to track the exposure time from the time they are taken out of ther packaging to the time

Re: Moisture ingression on components

Electronics Forum | Thu Apr 13 10:01:54 EDT 2000 | Wolfgang Busko

Hi: Use the whip on your operators.!!! Serious: The assembly should know how much time they have left to process those parts safely. Keep them as long as possible in the drybags, reclose the bags immediately after getting the needed parts out. In t

Re: Moisture ingression on components

Electronics Forum | Fri Apr 14 09:14:29 EDT 2000 | Rich Ziebell

C.Long, Have you thought of using a barcode reader system? Though costly, such a sytem would minimize the room for error and neglect by your operators. Yes, physical tickets would still need to be applied (barcodes labels) but there would be less ef

Re: PCB finishing

Electronics Forum | Fri Apr 14 10:16:27 EDT 2000 | PeterB

Dave, 'Free Issue' here in the UK means material (be it PCB's or anything else) supplied by our customer from their stock and not charged to us. That is why we sometimes cannot control the design parameters. Many thanks for the suggestions. We alre

Re: Help Bottom Side Components

Electronics Forum | Wed Apr 12 21:43:56 EDT 2000 | Micah Newcomb

Is this board going across wave? If not, you are pretty safe to lose the glue process. If it does go across wave you can probably lose the solderpaste and replace your solder stencil with a glue stencil, much faster and efficient than dispensing.

Re: ref: tombstoning on chip capacitors

Electronics Forum | Wed Apr 12 21:33:27 EDT 2000 | Micah Newcomb

Billy and Chris have a good point, pad size and geometry will affect proper aperture size and geometry and could result in tombstoning. Also I have seen chips which require special pastes but I have never found this to be the cause of tombstoning, in

Re: ref: tombstoning on chip capacitors

Electronics Forum | Thu Apr 13 18:41:20 EDT 2000 | Michael Parker

I too have followed all of the useful suggestions provided herein. I still found some tombstoning which was specific to a manufacturers lot. I changed the reel to another brand and the problem went away. I suspect contamination or oxidation on the co

ESD Compliant - Air blow off to dry washed circuit board assemblies

Electronics Forum | Tue Apr 11 17:45:02 EDT 2000 | Ashok Dhawan

I am looking for an appropriate method to dry wave soldered boards. While board assemblies are passed through board cleaning station , they are not fully dry . We do not want to heat above 180 deg F to dry them completely. We think that air drying u

Micro BGA soldering

Electronics Forum | Tue Apr 11 08:57:35 EDT 2000 | Alfred

Can you get me a recommendation regarding a Micro BGA soldering. It is apparent there is a problem and I want to insure success by following recommended practices. Is there a particular solder mask configuration recommended, as far as stencil thick


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