Electronics Forum | Fri Mar 22 10:55:11 EST 2002 | slthomas
Dave, you are THE master of the search. I made the lame assumption that if they'd had layout specs. for a part, it would be part of the spec. Bad assumption. The layout for the decal from that page you linked to is exactly what I needed. I look
Electronics Forum | Fri Mar 29 10:51:20 EST 2002 | lsmith
The IPC-EM-782 reads as follows: the adjustment factor is usually intended to increase the Z dimension slightly, but brings the Z maximum up to an even equivalent. Example if Zmax is 2.100mm then you would enter an adjustment factor of .100mm. The ad
Electronics Forum | Fri Mar 29 11:32:37 EST 2002 | slthomas
Thanks, Larry, more good info. I think my designer has that spec. in his library. What we DID find that while we had the proper pattern called out in our in house spec. sheet for the part, the designers don't look at the spec. sheets. They just grab
Electronics Forum | Fri Mar 22 10:44:52 EST 2002 | Yannick
hi, we just have a new board to mount and on it we have almost 15 connector like this one TSM-103-02-T-DH-LC...it's a SMT .025" (0,64MM) SQUARE POST HEADER we are not able to place this component with our machine( it's a philips) and doing it by
Electronics Forum | Fri Mar 22 17:14:15 EST 2002 | jseagle
What is the height, width, and length of the connector, packaging? We currently place a 2x20 2mm gull wing SMT connector measuring 8mm H x 38mm L x 6.1mm W, packaged on tape and reel with a plastic pickup in the center. We do this on an Assembleon
Electronics Forum | Fri Mar 22 21:31:25 EST 2002 | ianchan
Hi Guys, Anyone have "comments/testimony" on having possible quality level achievements, for AQL=0.1, C=0 ??? Is this a realistic "1st Pass Yield" expectation? how about for OQC submission Lots from production? especially in a high-mix, low-volu
Electronics Forum | Sun Mar 24 23:11:36 EST 2002 | sy_koh
I am looking technology for BCC package. The preliminary datasheet from customer show that it had rectangular flat pad on the joint. The smallest pitch is 0.6mm having 96 I/Os. I am currently putting BGA, uBGA, CSP and CBGA onto PCBs usinf no-clean
Electronics Forum | Thu Aug 08 16:41:18 EDT 2002 | davef
On our last thing like that [5X5, 32, er 28?], we printed bumps on the QFN, but you can't do that, so there's no sense in tormenting you. Ideas that come to mind are: * Search around SMTnet for a paper by Chrys Shea on controlling dispense shots as
Electronics Forum | Fri Aug 09 11:59:31 EDT 2002 | bcceng
Tom, I developed a process for applying solder bumps on BCC32 and BCC48 successfully on my previous employer. The quantities were in the thousands a week, the following process is what I was using: Insert BCC's on process carrier (carrier holds 500
Electronics Forum | Thu Mar 28 08:27:56 EST 2002 | davef
Don't be concerned. Brian and Neil don't allow us to link directly to email from SMTnet [even though from the way the link changes color you'd think you could. They do this to subjugate the huddling masses and lord the power of cold fusion over us.
