Electronics Forum | Tue Jun 24 17:52:39 EDT 2003 | russ
i don't know of anything on the market nut you may just want to draw one up and have it built either externally or even internaly. I picture a small square of ESD material with a lip around it with a small opening in one corner. Do you receive any I
Electronics Forum | Wed Jun 25 18:04:49 EDT 2003 | MikeF
It looks like we'll have to go the conductive process tray route. I looked through web sites for Brick Container and several other esd suppliers and did not find anything that would work. I saw the tray you mentioned in my Techni-tool catalog, but wa
Electronics Forum | Wed Jun 25 06:43:06 EDT 2003 | cyber_wolf
We are currently producing a board for a customer that has about 400 gold fingers that get wire bonded after the assy. leaves our facility. We have tried many different approaches to ensure that we are not getting solder on the gold fingers. Nothing
Electronics Forum | Wed Jun 25 12:08:53 EDT 2003 | russ
I battle this all the time, I don't believe that it is the "gold corner" that is causing the problem but something with the PCB layer makeup (copper planes, or bottom side components, etc.). It could also be the nozzle you are using has a "hot spot/
Electronics Forum | Thu Jun 26 09:04:43 EDT 2003 | caldon
We had a "Spring loaded" fixture that pulled the Flex tight and used loads of Board supports. There were pins that went through the Connectors holes and held the flex firm. We only had a few components so it was no problem. Lucky for us because the f
Electronics Forum | Thu Jun 26 08:49:21 EDT 2003 | caldon
Depends on your Material (Chemistry) and Machine. We use a hot plate with the material in an "L" patern. The Hot plate is used only in aiding the capillary action. Also, is time an issue?? Here is a good paper from Asymtek that was poster in Advan
Electronics Forum | Fri Jun 27 19:10:44 EDT 2003 | russ
Tina, I agree with Dave 100%, I also work at a contract house and the first thing we do is tell our customers our concerns with OSP. Usually what happens is we build the first lot with OSP since they are usually built already and all subsequent lots
Electronics Forum | Fri Jun 27 08:34:01 EDT 2003 | caldon
You should also look at the Semiconductor assembly side as well. Datacon and others are working hard to knock down the barriers between SMT and Semi. Also look at process obsolescence! Flip chip has been around for year but has not made it into main
Electronics Forum | Thu Jun 26 18:53:43 EDT 2003 | rlwilliams
I'd like to poll the audience: When it comes to creating/naming files for your oven recipes, do you select from a given set of recipes (E.g., 10 recipes used for all assemblies), or do you, create a 1-for-1 relationship where you have a recipe for e
Electronics Forum | Fri Jun 27 12:27:37 EDT 2003 | russ
We basically have 5-6 recipes for each oven based on mass etc... However if you like to have a quickfire way to ensure that the correct profile is running (like in a process audit) It is nice to see that the board and profile number match. (Running b
