Electronics Forum | Wed Apr 07 10:19:04 EDT 2004 | Fraser Law
Hi, I am a graduating student looking for information on building my own business in the electronics industry and am looking for a gap in this market. Could you help me with the following issues, what are the main implications in changing an assemb
Electronics Forum | Thu Apr 08 14:21:31 EDT 2004 | mnguyen
We are looking to buy a insertion line TDK AC-7 Axial machine and a VC-7AT Radial machine. I am curious if there are any software out there that can program the machines. Spoke with Aegis and circuitcam and they told me they do not have any software
Electronics Forum | Mon Apr 12 08:10:17 EDT 2004 | wgaffubar
We are sometimes, not always, seeing very large voids in the solder joints of BGA's with Via in Pad. Some lots of PCB will have the voids and other lots of boards will not. I feel the via's are outgassing during reflow, due to the PCB not having been
Electronics Forum | Tue Apr 13 10:30:52 EDT 2004 | Ken
Threre has been speculation as to voiding as a function of solder paste liquiduous vs. ball liquiduous. Gas entrapment is thought to result if one melts before the other (I forget which order). Two profiles may yield different results as determined
Electronics Forum | Mon Apr 12 11:32:47 EDT 2004 | Luis Lazcano
Can you share some information on the hazardous materials and cleaning details for your manufacturing processes, please ? These are the questions I need to ask you: 1. Do you use brominated fire retardant in PWB material? If not, what other type
Electronics Forum | Tue Apr 13 14:14:59 EDT 2004 | russ
I have actually printed this same condition with type 3 paste Alpha WS709. I posted this for discussion and cannot remember what I called it. We did need to clean the stencil after every three prints. I did not check volume on these locations but
Electronics Forum | Thu Apr 29 17:35:17 EDT 2004 | Shinmoto
Hi there, We place FBGA packages on a lot of our memory modules. Our stencils have .013" square apertures and a .005" foil thickness. We are using a type 4 paste from Senju Comtek. The price difference is not that significant and readily available
Electronics Forum | Sun Apr 18 07:01:10 EDT 2004 | Nick Prince
"Thanks for all your informative replies. I do know that Motorola is using a No Clean Eutectic Solder for their BGA's. We are in Aerospace and is using a Water Soluble Paste Flux." This statement is confusing me (not to difficult at my time of life)
Electronics Forum | Tue Apr 13 18:57:57 EDT 2004 | TWegrzyn
Does anybody have any experience with PSA 2668 high shear cover tape on Fuji QP242s/QP351s feeders? Does it perform comparable to PSA 2666? We are looking to implement PSA 2668 due to some cover tape 'pop-off' issues with our Siemens HF machine, bu
Electronics Forum | Wed Apr 14 20:24:48 EDT 2004 | Ken
What do you mean the solder must "survive" 260C? What is your target temperature? Is it dictated by a component, the substrate or the solder alloy? Do you require a eutectic alloy? If not, the selection of alloys grows. (these are from memory...n
