Electronics Forum | Sat Dec 10 19:10:17 EST 2005 | mika
Most of the chip; res & caps are already lead-free or RoHS compliant and you most certainly already solder them in your regular leaded reflow process. However, there are a few more component packages except from BGA:s that are NOT backwards compatib
Electronics Forum | Sat Dec 10 20:58:05 EST 2005 | Mike
How about this scenario: Need to rework a BGA on a 2 year old board. Originally the board was assembled with Sn63/Pb37 and the BGA has eutectic spheres. Now this package only comes with lead free balls. I believe that the board finish is not idea
Electronics Forum | Sun Dec 11 20:23:52 EST 2005 | grantp
Hi, As far as I know soldering a lead free BGA in a lead process is similar to soldering down some BGA's such as ceramic that had high temp solder balls. Remember back when a lot of BGA's had hi temp solder balls that also did not collapse during re
Electronics Forum | Tue Dec 13 12:47:53 EST 2005 | grantp
Hi, No because we don't have the ability to do that, and what is the problem with it? Can you describe what happens and how it's different to soldering a high temp BGA solder ball. My guess is if the solder ball does not melt, then there should be n
Electronics Forum | Thu Dec 15 12:10:07 EST 2005 | muse95
It should be the other way around. A Pb BGA ball will fully melt in a Pb free process, but a Pb free BGA ball will not fully melt in a Pb process, which means the Pb from the paste on the board will not fully diffuse through the ball. This leads to
Electronics Forum | Thu Dec 15 16:31:45 EST 2005 | Samir Nagaheenanajar
The general consensus is - you can run Pb-Free/RoHS parts in a Sn-Pb process as long as you RUN HOTTER. I've heard that "running hotter" means greater peak temperatures exceeding 217 / 221 C - common SAC alloy eutectic points. Anybody know any gene
Electronics Forum | Fri Dec 16 19:48:16 EST 2005 | Ola
Mika has a point here. AMD has some RoHS compliant components that are Not backwards compatible, in terms of leaded soldering paste & reflow temperature! They are Not willing to tell You Why! I think it has to do with something like: http://www.webel
Electronics Forum | Sat Dec 17 17:08:13 EST 2005 | grantp
Hi, The issue I see is they don't tell you why the component is not back compatible. We have suppliers telling us all kinds of things right now, and I don't think any of them actually know what's going on. No one seems to have firm research that sa
Electronics Forum | Wed Feb 01 17:03:04 EST 2006 | grantp
Hi, What's the difference between soldering a lead free solder ball BGA onto a footprint with lead solder paste when the ball does not collapse, compared to a lead-less package. The BGA is bigger, but you rely on the solder paste only, seems to work
Electronics Forum | Wed Feb 01 17:36:37 EST 2006 | Cal Kolokoy
Your method of only using solder paste to form the solder joint w/out collapsing the ball is very unconventional, just as others have mentioned on this thread. I bet you those joints will fail under thermal and mechanical stress. Have you done due
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