Electronics Forum | Mon Jul 09 19:09:27 EDT 2012 | jorge_quijano
We used to have a manual printer machine, we could never align the stencil over the PCB well, now with the new stencil we have less defects but still appearing on the Top list. I tried to use more fids as you recommend and one issue I faced was that
Electronics Forum | Tue Jul 10 09:00:47 EDT 2012 | stentech
until you know if you stencil does align with the pads on the board all the fids in the world will not help you. registration is key. We do it a lot at our facility in Toronto as we have lots of measuring equipment. In cases like this. We lay the ste
Electronics Forum | Fri Jun 29 12:47:25 EDT 2012 | deanm
We are experiencing widely varying First Pass Yields for selective soldering. Some boards are near 100% while others are less than 50% depending on the pitch and general complexity of the board. Question: If you are running 100 boards through your s
Electronics Forum | Tue Jul 03 16:59:18 EDT 2012 | dontfeedphils
Reflowing a BGA can be a reliable and long term fix, but it has to be done correclty, and using a heat gun and going in circles around the part is definitly not the right way to do it. To do it correctly you would flux under the bga, use a rework st
Electronics Forum | Wed Jul 04 13:25:03 EDT 2012 | davef
Baking boards to remove moisture takes a lot more energy than you'd think. Following on with this, Chris Hunt from NPL gave a presentation at IPC APEX 2012 about the results of his research ["Impedance Testing for Sensitivity to Delamination in Print
Electronics Forum | Wed Jul 04 16:40:56 EDT 2012 | comatose
We use a lot of single row breakaway pin headers. Right now we order then as sticks of 36 and I just have a tech break them into whatever lengths we need (3 pin, 5 pin, 8 pin, whatever.) I'm trying to streamline our auxillary processes. I know you ca
Electronics Forum | Thu Jul 05 21:07:09 EDT 2012 | davef
Probably they had a problem with a certain product, tried baking, the problem went away and ever since there stuck with this money loosing process. So, ... * Write up a plan to split a couple of batches, bake a portion of each batch, don't bake the o
Electronics Forum | Fri Jul 06 05:28:59 EDT 2012 | jsolloway
..... that's very strange. If there were any risk of de-lamination then it would of occurred during the reflow process, surely. Unless the through hole department are using heat guns or wave sodler? I doubt if the sales or planning team are happy if
Electronics Forum | Fri Jul 13 08:03:54 EDT 2012 | cobham1
I appreciate all the feedback. The reason I was asking the question is because we have an internal documnet that states we need to bake for 16 hours after the boards are cleaned. This just seemed to long for what little moisture is really removed. I
Electronics Forum | Sat Jul 07 11:45:26 EDT 2012 | btipcb
I purchased and am setting up a used QSA30. It has been a little frustrating but I finally have an almost program. The isse is that I can not generate a placement program because it says that the ANC is not registered. I can look at it on the sy
