Electronics Forum | Tue Nov 14 10:22:07 EST 2000 | Stefan Witte
Without using a glass plate you could check if your jaws could properly align the compomnents by writing a small vice versa program. Place a component in a 0 degree angle and another one right next to it in a 180 degree angle. Built up a line of lets
Electronics Forum | Wed Nov 08 11:48:09 EST 2000 | Chris May
Gary, Here goes for what it is worth. We store all of our SM reels in the SM area in proper trolleys (Mossmann-Tebbs types). They are stored by part number, which sets them into Capacitors by value and size. Resistors the same and so on with induc
Electronics Forum | Thu Nov 09 10:22:46 EST 2000 | John
Luckily for me, if the part were soldered and on the board prior to any processing, I will still be able to build it. I am currently experimenting with screen printing a high temp paste, hand inserting the part (even Chad hasn't come up with an econ
Electronics Forum | Fri Nov 10 17:47:50 EST 2000 | Dave F
I can�t imagine a high trace count, high via count ceramic board matching-up on price with a FR4 board. http://www.coorstek.com/coorstek/coorstek.asp?menu=literature&reference=literature.asp But that�s not really the issue, is it? The issue is the r
Electronics Forum | Tue Nov 07 08:09:19 EST 2000 | adam
WE are using press fit connnectors on a range of boards, one of which is posing me a few process questions . The Machine is a fully automatic machine. The problem is intermittent and I can't seem to put a finger on it. An array of connectors ( consi
Electronics Forum | Tue Nov 07 09:26:37 EST 2000 | Peter Barton
Adam, The most common cause for this problem is a variation in the plating thickness of the through holes, particularly if they are Sn/Pb solder levelled PCB's. Most pressfit connectors require a fairly tight control on the diameter of the holes to
Electronics Forum | Mon Nov 06 12:19:25 EST 2000 | Tom Gervascio
I ma trying to get some information on possible causes and screening tests for PCB delamination. Is the main cause moisture absorption of PCB material or entrapped chemicals and or air in innerlayers that expand when expsoed to subsequent reflow and
Electronics Forum | Tue Nov 07 02:50:41 EST 2000 | CharTrain
A solder wetting balance will indicate a time of less than one second for wetting to occur to a solderable surface. The additional time is required to get the metalized surfaces up to soldering temperature. A single sided board has very little mass a
Electronics Forum | Wed Nov 01 13:44:50 EST 2000 | Thomas Ballhausen
Using convection type reflow we observed following problem: One ball of a 313-PBGA appears to be dewetting. This happens randomly, i.e. no specific ball location, failure rate is rather low (3-4%), but since there are 12 PBGAs on one board the failu
Electronics Forum | Mon Nov 06 09:38:55 EST 2000 | Dean Stadem
We have seen this problem several times. It always goes back to pad solderability, very seldom does it have anything to do with ball size. If there is no evidence of wetting on that pad, but all of the other pads did solder, you need to ask yourself
