Electronics Forum | Tue Sep 21 13:25:18 EDT 1999 | Dave F
| | | I like to see if anyone has any info or experinces with metal inspection templates in a post oven process. | | | My problem issue is the ESD, since they are metal(12 mil stencil material). I welcome any comment. | | | | | | Thank you. | | | |
Electronics Forum | Tue Sep 21 15:31:05 EDT 1999 | Hugh Martin
| | | | I like to see if anyone has any info or experinces with metal inspection templates in a post oven process. | | | | My problem issue is the ESD, since they are metal(12 mil stencil material). I welcome any comment. | | | | | | | | Thank you.
Electronics Forum | Wed Sep 22 22:32:40 EDT 1999 | Dave F
| We are finding solder shorts under 1206 Components on the bottom side of our boards.In all cases these shorts are from either side of the component to a feed-thru under the component body. Adhesive is used to glue down the component and then the bo
Electronics Forum | Tue Sep 21 13:17:29 EDT 1999 | Dave F
snip | I've often been tempted to try something a little different when specifying QFP apertures. Like, for example, using long, tapered triangular apertures arranged in alternating directions. The objective being, get the maximum amount of paste do
Electronics Forum | Tue Nov 09 13:12:26 EST 1999 | Dave F
Steve: Sure, but let's figure it out for you!!! ;-) Here�s some sample calculations. Your results may vary, void where prohibited, etc 20 PITCH: Pinched aperture volume: 0.010"X0.050"X0.005" = 2.5 uin^3 Zippered aperture volume: (0.015"X~0.5)
Electronics Forum | Mon Sep 20 17:26:22 EDT 1999 | Earl Moon
| I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. | The stencil is 6 mil thick, laser cut and electo-polished. | The apertures are 12 mil in diameter with 20 mil pitch. | We are usi
Electronics Forum | Mon Sep 20 17:46:21 EDT 1999 | Dave F
| I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. | The stencil is 6 mil thick, laser cut and electo-polished. | The apertures are 12 mil in diameter with 20 mil pitch. | We are usi
Electronics Forum | Tue Sep 21 12:10:23 EDT 1999 | Mario
| I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. | The stencil is 6 mil thick, laser cut and electo-polished. | The apertures are 12 mil in diameter with 20 mil pitch. | We are usi
Electronics Forum | Mon Sep 20 08:21:52 EDT 1999 | Mohammed saad
Hi all, We have a little discussion here about the suitable flux for a certain process, as all of us are beginners we need your advice. We are producing VGA cards and mother boards for PC's all components to be wave soldered are TH, the SMD is done
Electronics Forum | Mon Sep 20 11:53:41 EDT 1999 | Scott S. Snider
| HI everyone, | | We are using a Siemens ap-25 screen printer, in the past we have not had any problems with adhesive placement until a couple of weeks ago. It seems the x axis has decided that it should be set somewhere between .00085 and .001
