Electronics Forum | Tue Oct 30 22:08:45 EST 2001 | flynhi34
I have not looked into eutectic die attach. My dies are about .012" square and could get smaller. Currently using a Epoxytech conductive adhesive. I am going to go out and look at equipment and build samples. Some vendores state they can do .010"
Electronics Forum | Fri Nov 02 17:16:53 EST 2001 | davef
Planned maintenance is: * Scheduled based on the equipment supplier recommendations. These maintenance schedules may be modified based on clear-headed thinking that is documented. * Calibration may not be slipped, but the schedule may be moved up. [
Electronics Forum | Tue Oct 30 21:42:32 EST 2001 | surachai
I have question about board baking after in line washing machine then I would like to know some information that ; 1) Do we need board baking after in line washing machine? Both bare board and assembly borad normally we don't bake . 2)In case of ne
Electronics Forum | Thu Nov 01 17:35:04 EST 2001 | davef
A couple of things: * Don�t do it. Securing both the plastic case and the lead to prevent breaking the case seal is very difficult to do while you reform the lead. Just resell the parts and buy the correct parts. * If you will not listen and insist
Electronics Forum | Wed Oct 31 18:00:51 EST 2001 | Jonathan Mitchell
Hi All! In the near future we will begin to take on products that require a reflow process on both sides. We will run the backside first (smaller components) to reduce the chances of a part falling off during the second reflow, but my question is abo
Electronics Forum | Thu Nov 01 04:52:50 EST 2001 | wbu
Hi Brian, yes that�s possible due to the presence of Au in the joint but nothing to worry if the Ni/Au is done properly (means not to much Au in your plating). "rugged" I haven�t noticed yet, that may depend on the definition and maybe the magnifica
Electronics Forum | Thu Nov 01 05:30:06 EST 2001 | wbu
This is not about the physical laws but besides contamination, which will actually IMO cause NO WETTING, it is quite vital that the time-limit the flux is active is not exceeded during your reflow process. Depending on your paste/flux you will have a
Electronics Forum | Sat Nov 03 05:19:59 EST 2001 | Ben
Hi I have question about thermocouple type use for Super M.O.L.E. I found in some article that type K T/C (Nickel-Chromium vs. Nickel-Aluminum) may suffer from temperature cycling hysteresis at above 250 degree C and also diffecult to solder. Now
Electronics Forum | Wed Nov 07 21:16:44 EST 2001 | davef
Consider using the following hierarchy of rules for pad design: 1. If you have a land pattern in a manufacturer�s data sheet, use it. 2. If the data sheet doesn't have a land pattern, but does have an RLP (registered land pattern) number or JEDEC n
Electronics Forum | Tue Nov 13 11:22:50 EST 2001 | fmonette
Dave, Hany, I was actually surprised to hear that topside SMT components can reach such a high temperature during wave soldering. If this is the case then the concern for component damage is very valid. This morning I discussed this issue with Jac
