Electronics Forum | Thu Nov 03 10:36:12 EST 2005 | 1startical
Steve, Dave has initiated this threat to find a solution for his Quad, but ultimately, it's to solve his production issues, my suggestions was to help Dave out if he wanted it. To make it clear, I did not advertize my company's name nor address, not
Electronics Forum | Thu Nov 10 15:43:10 EST 2005 | 1st Article
myu, Is using a 0.6mm stencil wise? 42.5 X 42.5 has two models, the 1mm pitch has 41x41 array with 1657 I/O and the 1.27mm pitch has 33x33 with 1088 I/O. For a typical c-cga with 1.0mm - 1.27mm pitch, may requires a 2mil stencil, 1.0mm pitch gets .
Electronics Forum | Tue Nov 01 19:53:23 EST 2005 | KEN
Um...for you mylar guys....esd safe? Why worry about the first two prints. Worry if they power up or not when sent to funcitonal test. Zapp! I think I know where this is comming from. It is not that uncommon to have a sacrificial print. However,
Electronics Forum | Wed Nov 02 08:57:34 EST 2005 | russ
Don't have any graphics but they are relatively simple. 1. They do need to be put into the copper. 2. We usually use a 1mm circle but many other shapes and sizes are useable but I know that all machine will take a circle. 3. Maintain a keepout area
Electronics Forum | Fri Nov 04 22:16:56 EST 2005 | mika
I forgot to mention something about the local fiducial marks: In the "old days" where board stretch was a factor to count with; the use of local fid's around a fine pitch component was sometimes necessary; not to forget that the pick & place machines
Electronics Forum | Wed Nov 02 01:30:12 EST 2005 | fctassembly
Hello Arnold, Yes, by definition of joint formation, copper will dissolve in lead free solder in order to form the connecting intermetallic layer. There is a distinct difference in the copper dissolution rates of the major alloys being considered wi
Electronics Forum | Thu Nov 03 08:18:17 EST 2005 | fctassembly
Hello Arnold, Just to clarify the Sn100C discussion: Please note that SN100C is the Nihon Superior alloy composed of tin/.7copper/nickel. The key point in regard to SN100C is that Cu does not go directly into solution but first reacts to form an inte
Electronics Forum | Fri Nov 04 13:00:24 EST 2005 | pjc
Some clarification: Max bottom side component is not 5mm as someone posted, its 12.7mm (0.5"). This is if you're going to have a Gel-Flex block under that component. Any component height at or over 12.7mm must not have a Gel-Flex block under it. Al
Electronics Forum | Fri Nov 04 02:23:58 EST 2005 | grantp
Hi, Yes, you will save a lot of money in the end. From what I have experienced you cannot heat up a oven full of air, and cool it down fast enough to match a suitable reflow profile. So passing the board through the zones using an inline oven is th
Electronics Forum | Sat Nov 05 03:33:28 EST 2005 | grantp
Hi, I might not have been clear in my previous post on this, and the problem we saw is the hot metal of the oven walls caused IR transmission of heat into the board, and thats why the point in time from the start of the profile to the point the PCB
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