Electronics Forum | Tue Dec 27 07:22:44 EST 2005 | davef
It could be lots of things. You're not helping to narrow those alternatives. So, consider taking a sample to: * An analytical laboratory. * Teachers in the chemistry department at a local university. Kester recommends the following independent la
Electronics Forum | Thu Dec 29 03:57:16 EST 2005 | sparrow
Hello Chris, To be honest, it's hard to believe you could not bond to ENIG at all. Yes, the gold layer is thin and hard, but it just narrows the process window and does not make the bonding impossible. I say this, because we have been using TS gold w
Electronics Forum | Tue Jan 03 03:01:35 EST 2006 | Frank
The 740 and 760 basically have the same specs as far as component ranges: 0402-50mm components. The 760 is a bit more accurate and the vision system is better. The 740 was designed when BGA weren't really around and so it can barely vision center b
Electronics Forum | Tue Jan 03 22:00:32 EST 2006 | fdr4prez
Yes Rick, you are correct, Zevatech HBA, PPM7 & > PPM9 were all designed and built by Swiss. That > was a long long time ago. Sorry, I guess I forgot about those old beasts. Then don't forget about the good old CATs and Microns made by Zevatech
Electronics Forum | Tue Jan 10 14:44:42 EST 2006 | greg york
Not sure about Sn/Cu/Ni large market share here in Europe as we have a large part of the UK market with SACP0307 alloy 0.3%Ag introduced over Two years ago Also worked against Sn/Cu/Ni alloy with large TV Co and they went with 0.3%Ag due to reliabili
Electronics Forum | Fri Mar 31 12:27:27 EST 2006 | Marcus
We have used the SN100C for over a year now with fanastic results. We use the SAC305 for SMT and SN100C wire exclusively. There are no problem mixing the alloys. I am also on the commitee for the NASA testing. The SN100C did out perform SAC and SnPb
Electronics Forum | Tue Jan 03 16:23:37 EST 2006 | Phil
Our past experience with Frost and Sullivan is that they derive most of their data from interviews with the subject companies and press releases. That puts them a half a notch above asking the sales reps for info (except with F&S, the total won't be
Electronics Forum | Wed Jan 11 10:12:23 EST 2006 | ratsalad
I've used an old version (maybe 7 or 8 years old) of GC-Place to convert gerber to centroid data. It is semi-automatic. If I remember correctly we'd start by selecting the pads for the largest components first. The software would find matching gro
Electronics Forum | Wed Jan 04 12:48:34 EST 2006 | pjc
In-Circuit Test is the best method for ensuring solder joint connections. It is a much more reliable than AOI. An ICT machine can ensure solder connections are made for array package devices such as BGA, PGA, etc... AOI is best for component I.D.- is
Electronics Forum | Wed Jan 04 14:59:41 EST 2006 | AOI
I have used all of test and inspection techniques available out there: AOI, AXI, Flying Probe, ICT, and FCT. The reality is that they all have a place in manufacturing based on the type and complexity of product you bild, the industry it is intended