Electronics Forum | Wed Mar 25 20:00:32 EDT 2009 | davef
We are not sure what you mean by "any type like plastic, aluminum, stainless steel etc?" Binks [(US Corporate Offices), ITW Industrial Finishing, 195 Internationale Blvd., Glendale Heights, IL 60139; 630-237-5000 888-992-4657 http://www.binks.com] m
Electronics Forum | Fri Mar 27 10:04:51 EDT 2009 | ericthered
We have been having problems with proper wetting when running mainly lead free but also leaded solder in our Ersa Hotflow 3. Solder either often looks grainy or doesn't flow over the whole pad. This is generally the case when my profile is 170 firs
Electronics Forum | Sat Mar 28 17:38:14 EDT 2009 | Peter
Hi, I bought a Philips CSM84 machine 2 weeks ago. I have no experience on SMT machine so I try to learn everything from the manual. There is an error message when I program a simple program and try to get it executed. "PCB FIXING ERR. LOCATE PIN NO
Electronics Forum | Mon Mar 30 15:16:32 EDT 2009 | Peter
Hi Tom, You're right. I do find the second locating pin hardware. Now I got them both up/down when F3 is pressed. Thanks. I don't see any pin on the hardware and no edge clamp hardware either :-( , do you know any way that I can bypass these hardware
Electronics Forum | Fri Apr 03 02:15:23 EDT 2009 | roy1209
I've heard from my company's engineer that it'll be better to use Gerber format if there's some impedance control line . Because usually Gerber has code numbers in data and someone can easily refer to controlled line on the PCB and ODB++ doesn't have
Electronics Forum | Sat Apr 04 08:35:27 EDT 2009 | davef
Cause: Solder between the pad and the BGA on the pads being lifted has not melted. So, when you lift the BGA, you also lift those pads with the unmelted solder with the BGA. These pads are probably sinking the heat to a large copper plane in a inner
Electronics Forum | Mon Apr 06 11:53:50 EDT 2009 | ed_faranda
Here are some pictures of the part. I created a profile for this part. I've been in touch with the vendor and he seems to think the profile is too hot. I am waiting for another board from R&D so I can work on it again. If you look at the picture,
Electronics Forum | Fri Apr 10 07:52:16 EDT 2009 | davef
On cure checking, we have this undated note from Jack Crawford at IPC * IPC-SM-840C "Qualification and Performance of Permanent Solder Mask" has several Test Methods for different types of solder resist material, but probably the only applicable one
Electronics Forum | Wed Apr 08 11:05:53 EDT 2009 | boardhouse
Hi, Need a little more info, 1) this board is definitely delaminated 2) this board looks like a Std FR4 board with 63/37 Hot air finish with probably 140 tg. material. Was this reflowed under lead free temps? 3) Do you Pre-bake product 4) What
Electronics Forum | Sat Apr 11 09:56:31 EDT 2009 | davef
You're correct. You should expect to see an intermetallic layer in a proper solder connection. Try leaving the component at temperature for a longer period. Growth of intermetallic compounds on Cu surfaces [Klein Wassink]: d = 10^3(exp(-5*10^3/T)t^1
