Electronics Forum | Wed Aug 01 18:36:15 EDT 2018 | totalmedtech
Open->Job, you can select either 'Gerber' or 'Gerber274x' If you create the layer yourself you just need to press 'Add' in the bottom right of the screen and give it a name that means something to you, and the correct extension (I assume you know thi
Electronics Forum | Fri Jul 20 13:50:22 EDT 2018 | vchauhan
This question is regarding stencil design: I am having voids under QFN TI P/N LMZ20502SILT. I have attached component pic. Signal pin is 18X16 mils. Center pads are 31 mil sq. Initially I had stencil done with one mil per side reduction on signal pad
Electronics Forum | Fri Jul 27 09:47:20 EDT 2018 | davef
Adding to Rob's suggestions ... One of the theories about voiding in thermal / ground pads of BTC is: Solder starts melting at the edge of the pad and moves inward towards the center of the solder mass. This traps flux volatilizes. So, there needs t
Electronics Forum | Tue Aug 14 08:19:45 EDT 2018 | buckcho
Hello, other colleagues gave you valid ideas. I found it helpful if i reduce the size of the cooling openings. I would suggest making the four big square into very small many diamonds. This would maybe decrease your voiding with 2-4 percent. Btw how
Electronics Forum | Tue Jul 24 09:20:44 EDT 2018 | fugtussey
Note that the TF2800 features a large 7 panel preheater with an adjustable height component that allows you to adjust the height of the IR preheater to get much closer to the board. This feature multiples the power of the preheater exponentially, so
Electronics Forum | Wed Jul 25 02:40:24 EDT 2018 | cannizzaro
I have a question about the Gerber file format for PCB prototype. The CAD program I am using is a DOS version and generates Gerber files in the RS-274-D format. However, ALLPCB require the Gerber files in the RS-274-X format. I have to approach other
Electronics Forum | Tue Jul 31 04:45:42 EDT 2018 | robl
Depends on what sort of outfit you are working for, and what you are building. A lot of CEMs are doing Flying Probe or ICT on the boards ahead of investing time building into units or adding parts that prevent access to rework. We have a combination
Electronics Forum | Tue Jul 31 07:56:43 EDT 2018 | markme
A question for those that carry out SPI. How do you program? Do you take CAD data for the card which will provide a 1-1 pad outline or do you use the stencil data for the program is the actual tool used to determine the paste volume (Aperture reduct
Electronics Forum | Wed Aug 01 13:35:41 EDT 2018 | tey422
Need all your experts out there for tips & tricks to make things work. I been giving a task to help redesign a simple board; only to load two components. The challenge is to use pick-n-place machine to load the coil onto the 50up array panel. Previou
Electronics Forum | Wed Aug 01 15:18:40 EDT 2018 | dleeper
One option might be to convert the coil to through hole and use intrusive reflow AKA pin in paste. the coil leads would have to be formed perpendicular to the board instead of parallel. you would have through holes instead of SMT pads, but you would
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