Electronics Forum | Tue Nov 21 22:15:59 EST 2000 | Vince Whipple
Mohammed, The first suggested place to start with your question would probably be with your flux Mfr. Push them! The quantity of dross is effected by several factors: The higher your solder pot temp., the higher your dross level... but don't go too
Electronics Forum | Fri Nov 10 10:39:43 EST 2000 | omar_verdugo
Hello Eva. I was using Fujicam 1.1 and i had a problem with the theta is in the shape library for example all the drawings are on 0 degress like a in the part data and all that work fine with the anothers machines like a cp6, but when i use a ip2 i m
Electronics Forum | Mon Feb 05 17:18:53 EST 2001 | davef
Wha, Nellie!!! Delamination & Blistering IPC-A-600D Although it may occasionally occur because of a severe process breakdown, delamination and blistering occurs as a result of an inherent weakness of the material. Either condition represents a brea
Electronics Forum | Mon Nov 06 12:01:47 EST 2000 | Chad Pawlak
Late last week 10% of the population of Thorp, WI lost their employment. Saputo Cheese of Montreal Canada, formerly Stella Foods and formerly Blue Moon Cheese announced it will shut the doors to this 70 year tradition on Jan 3. Leaving in its wak
Electronics Forum | Tue Nov 07 10:09:51 EST 2000 | Kevin
John, Depends on what you're cleaning (paste, adhesive, ink, etc..) and your process (do operators just dump a dirty stencil in and expect a clean one out, drying time, effect on the polyester). I could suggest a couple of name brand cleaners, but I
Electronics Forum | Mon Nov 06 21:06:13 EST 2000 | Dave F
Thomas: Wheeee, a 40% failure rate. Now, that make your boss chase you around the room won�t it? As you indicated, x-ray won�t do dip about helping to identifying problems [or ball cracks either]. Consider using an ERSA scope [er whatever they ca
Electronics Forum | Wed Jan 17 03:35:07 EST 2001 | Arul
We have few failures similar to the discussion in this thread, on a 50 Mil pitch, 30 Mil mill Ball PBGA. Would like to understand the mechanism of the BGA reflow process bit more. Appreciate your response to the following. 1.We sheared few solder ba
Electronics Forum | Fri Jan 19 17:43:30 EST 2001 | davef
Intermetalic Layer (IL). A compound formed at the interface of two different metals, whose atoms have an extremely high natural attraction for each other, so high, that they do not bond to other elements by any other means. Also, intermetalic compo
Electronics Forum | Mon Nov 06 10:29:28 EST 2000 | Dean Stadem
All of the replies have merit. Here is another one. Because the cause of the tombstoning is wetting forces that are imbalanced, and one end wets faster or more readily than the other, the 0402 lifts up on that end easily because of its low mass. Incr
Electronics Forum | Tue Oct 31 03:50:20 EST 2000 | JohnW
Honda, Prnting Glueisn't as difficult as it sounds, as long as you have the right stuff and a good set up. It also depend's on what your going to be placing. If your just doing 0603, 0805 and 1208 than you really only need an 8 thou or 10 thou stenc
