Electronics Forum | Sun Nov 28 03:27:03 EST 2004 | jmedernach
Hi Guy, I see them frequently. Usually, if I have voids on my BGA's, I'll have them on my passives as well as at leaded device solder joints. They run rampant through the entire assembly. For me, it's a function of my profile. I only have a 4 zon
Electronics Forum | Fri Jan 21 13:39:15 EST 2005 | Chunks
Directors and company owners care since they're buying it. It's like an odometer on a car - just an indicator. But like your chipshooter example, moving parts on an oven wear out too. They just don't stop working. Plus they're subjected to higher
Electronics Forum | Tue Feb 01 12:52:19 EST 2005 | jbrower
Hi Tom, I did talk to Bob Gilbert about the sn100c. His comment is that it is a nickle stabalized alloy. Simplisticly, the tin and copper molecules would rather bond with the nickle. He also mentioned that with the SAC alloys, the manufactuers were
Electronics Forum | Mon May 30 11:37:01 EDT 2005 | stepheniii
I don't know this machine but I have seen a similar problem on other machines. Have you cleaned and lubed the guide rods for the x-axis? It's easy to forget that AOI machines do need some maintenance. Is it possible that it hangs, while waiting for t
Electronics Forum | Mon Jun 13 11:56:29 EDT 2005 | patrickbruneel
Hi All, There are IPC drafts in circulation IPC-1751, Generic Requirements for Declaration Process Management and IPC-1752, Materials Declaration Management. To me it looks like the regulations become more tolerable towards lead in solder Lead in s
Electronics Forum | Mon Aug 08 08:18:52 EDT 2005 | davef
Rob We agree with Jason's point about swab lead indicators. You need to be careful interpreting the results. Lead must be in sufficient measurable quantities as found in Sn 63/37 or Sn 60/40 solders. Handheld units are: * Oxford (bought the X-Met
Electronics Forum | Mon Aug 29 11:05:10 EDT 2005 | foresiteeric
davef: I am a colleague of Sara at Foresite and we came to the conclusion that the solder balls were entrapped based on the minimal amount of information from the original question and the fact that the x-ray showed the balls and it wasn't mentioned
Electronics Forum | Fri Sep 09 07:55:08 EDT 2005 | davef
This pattern indicates flex cracking due to excessive bending of the board or fixture after soldering. Ceramic is strong in compression, but weak in tension. When bending causes damaged parts, look at: * Board flexes, ceramic is strong in compressio
Electronics Forum | Wed Jan 18 08:34:09 EST 2006 | Nathan
We are designing a new in-line inpsection station for PCBAs and I am a little confused about how to interpret two the Mech. Interface standards in SMEMA 1.2 (items 5 and 6). What is exactly meant by "maximum gap"? Does this get at the distance betw
Electronics Forum | Thu Apr 20 08:49:08 EDT 2006 | Chunks
a) Is there a recommended dip or dwell time for the dip soldering? Check your data sheet for the part. Dwell time is everything in selective soldering. Top side wetting is a good process indicator. b) How do we improve the solder coverage in the
