Electronics Forum: inspection (Page 186 of 311)

BGA standards

Electronics Forum | Tue Apr 03 00:55:34 EDT 2001 | philipreyes

Hello Billy!! IPC 7095 covers all the design rules and guide lines in BGA assembly and inspection, this will help you a lot in your problem...But based on your problem, it seems that all the balls were disappeared, try to check the capability of

Re: Stacking of Bare Boards

Electronics Forum | Tue Apr 11 16:11:06 EDT 2000 | John Thorup

Hello Ashok I can't recall mask damage through normal handling that did not have an adhesion or cure problem as its root cause. Most of our boards arrive shrink packed in groups of 10. We simply pop off the wrap one pack at a time and leave them in

Solder Balls

Electronics Forum | Tue Apr 04 06:22:07 EDT 2000 | Neil Stoddart

Help. We are moving to a no clean solder paste and have the following concerns regarding solder balls. What standards are currently being followed concerning solder balls on SMT assemblies? Are these standards realistic and can they be easily achie

Re: Solder Balls

Electronics Forum | Tue Apr 04 07:46:03 EDT 2000 | Donnie

Neil, We currently use only visual inspection with a magnified lamp and actually brush the board after the wave process to help knock off any solder balls. You wanna use an ESD sensitive brush material. Camel hair is what we use. It works real wel

Re: Solder Mask Bubbling off after Wave Soldering

Electronics Forum | Tue Apr 04 10:18:58 EDT 2000 | Russ

Brian, I agree with Jesper, You seem to have a PCB supplier problem! The conditions that you are processing your assembly with are nothing unusual and in fact very standard throughout all of the manufacturing facilities that I have been in, unless

solder stain on gold finguers

Electronics Forum | Fri Feb 23 10:07:32 EST 2001 | jmlasserre

I would like to have some advise or explaination about the IPC610 spec. Page 6-51 and 6-52 concerning the solder stains on gold finguers: On the page 6-51, it's recommended to inspect the gold finguers with the unaided eye, but on the page 6-52, th

AOI systems

Electronics Forum | Fri Mar 30 07:14:42 EST 2001 | pteerink

Genny, Xray systems ( or at least what I have seen ) are a manual based system. That is, you put the board on the machine and look at certain locations that you want to inspect. What we have in mind is an automated system that will catch obvious, no

AOI systems

Electronics Forum | Fri Mar 30 07:14:51 EST 2001 | pteerink

Genny, Xray systems ( or at least what I have seen ) are a manual based system. That is, you put the board on the machine and look at certain locations that you want to inspect. What we have in mind is an automated system that will catch obvious, no

AOI systems

Electronics Forum | Fri Mar 30 14:43:55 EST 2001 | larryk

Phil, The AOI will do a excellent job doing what you said you are looking for. We justified ours on the same requirements as you stated. Keep in mind that the machine may not "see" everything, there are some hidden joints that you will still need to

Solder Paste Volume

Electronics Forum | Thu Mar 29 01:22:57 EST 2001 | chinaman

Hello everybody, Two questions came up during an audit (old topics once more): 1. we are not checking the solder paste volume/pad height after printing - others are using an AOI, but is it really necessary? We just do visual inspection randomly. We


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