Electronics Forum | Sun Oct 11 13:53:26 EDT 1998 | Vincenzo Longobardo
I have datas to substain that a not wetting PCB ( the HAL oxided or not uniform in thickness )if soldered in reflow, it shows voids with X-Ray inspection.The voids are in side all the joints not only on the solder pads levell. Is there a technical d
Electronics Forum | Mon Oct 12 08:07:45 EDT 1998 | Earl Moon
| I have datas to substain that a not wetting PCB ( the HAL oxided or not uniform in thickness )if soldered in reflow, it shows voids with X-Ray inspection.The voids are in side all the joints not only on the solder pads levell. | | Is there a techn
Electronics Forum | Thu Jun 07 13:40:12 EDT 2001 | kerryn
Dave, We have very short runs (less than one hour). We have stencils all over the place waiting to be cleaned. It is too time consuming to scope each stencil to inspect for cleanliness. Do you know of any automated or scanning devices that can ra
Electronics Forum | Thu Jun 07 15:37:32 EDT 2001 | Claude_Couture
Kerryn, It's the first time I hear someone who needs an automated inspection machine to check the cleanliness of stencils. Why not improve on the cleaning method itself. I use ultrasonic batch cleaner. It takes 3 minutes to clean a stencil, 2 minutes
Electronics Forum | Tue Jun 05 13:23:27 EDT 2001 | kerryn
We are a high-mix/low-volume operation and end up cleaning 40 - 50 stencils per day. Does anybody know of an automated inspection system or "scanner" that can check a stencil for cleanliness?
Electronics Forum | Fri Feb 14 11:45:11 EST 2003 | SV
I was wondering if you guys had any experience with a distributed coverage Test and inspection strategy (Awaretest Xi) and could point me to technical studies in the field. thanks
Electronics Forum | Thu Sep 07 03:57:39 EDT 2000 | Steven Cheung
Does anyone know of a freely-available document which discusses the main considerations of BGA assembly and inspection (x-ray?). l need to know about pad sizes and inspection standards and when to underfill and when not to etc.. l am looking at ass
Electronics Forum | Wed Jun 06 21:19:41 EDT 2001 | davef
Consider running two sets of stencils and washing every four hours.
Electronics Forum | Mon Apr 02 17:16:22 EDT 2001 | kward
Try IPC-7095. It is not free , but discusses in-depth Design and Assembly Process implementation for BGAs. Website is ipc.org
Electronics Forum | Tue Jun 05 16:40:46 EDT 2001 | kerryn
Thanks Phil. However, my objective is to identify stencils that are not 100% clean prior to sending to inventory. I want to catch it before the solder paste has a chance to dry and harden in the apertures. Kerry
Our Company handle AOI (Auto Optical Inspection) and SPI (Solder Paste Inspection) Machines.
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