Electronics Forum | Tue Sep 14 02:46:17 EDT 2010 | grahamcooper22
Hi Gani, Looking at the pictures in the report it looks as if there is a thin coating of solder on the pcb pad....but it looks like the BGA sphere was barely in contact with the pad. This could be caused by insufficient solder paste on this pad...may
Electronics Forum | Fri Dec 01 07:46:41 EST 2006 | davef
Bridging Causes: * Insufficient flux * Excessive pre-heat * High conveyor speed * Solder contamination
Electronics Forum | Wed Sep 24 04:18:12 EDT 2008 | gang
we have some problems in soldering joints such as insufficient solder and misalignment on some RC0402 and CC0402,i don't have a pic here. our SMT enginner doubts the PCB land pattern is at the fault.here is what we measured results.pad length:0.9mm,
Electronics Forum | Thu May 29 14:48:45 EDT 2014 | olek
On one of our designs, we use LEDs Lite-On/LTST-S110TB (SMD). PCB footprint was designed according to manufacturer's recommendations. However, our vendor has problems with assembling these parts. Some parts are tilted, other have bad solder joints or
Electronics Forum | Fri May 30 20:03:14 EDT 2014 | hegemon
Starting with the manufacturers layout is a good start. Tilted parts, bad solder joints, sounds like a wetting issue and the board or the parts. Insufficient solder sounds like the printing process needs some attention. We have used this part in th
Electronics Forum | Fri Mar 06 12:02:36 EST 2015 | saoasasd
So far we have tried diferent date codes, solder pastes and PCBA models (same component used in different projects). We have also sent some components for plating analysis and we are waiting the LAB feedback. Additionally, we have tried components wi
Electronics Forum | Tue Dec 08 15:19:42 EST 2015 | proceng1
Apply the correct amount of paste for the pad size should work ok, as long as the part starts out in the paste. If you have a reduced aperture and the leg doesn't quite touch any paste could result in non-wetting or insufficient solder issues. I gu
Electronics Forum | Thu Nov 30 00:41:23 EST 2017 | abhilash4788
Dear All, I have OSP finsh pcb on my production, the pcb thickness is 1.5mm and the product is one sideded pcba. After reflow process, Is there any specific time frame defined for smt completed OSP finish pcba before going for wave soldering proce
Electronics Forum | Mon Feb 21 11:22:21 EST 2000 | K. Ckak
Hi Kurt, I agree with Dave F. I had exact same problem with PBGA placement. We requested our PCB vendor to plug/tent via (button printing) after HASL with SR1000 which worked well in the long run. There are couple of failure modes associated wit
Electronics Forum | Mon Feb 21 11:22:21 EST 2000 | K. Ckak
Hi Kurt, I agree with Dave F. I had exact same problem with PBGA placement. We requested our PCB vendor to plug/tent via (button printing) after HASL with SR1000 which worked well in the long run. There are couple of failure modes associated wit