Electronics Forum | Mon Sep 14 09:09:10 EDT 1998 | Earl Moon
| I am running composite fixtures on my wave solder machine and after about 500 passes each (1 month)they are showing serious signs of wear in that the composite surface is bubbling up and glass fibers are also starting to show. | The problem here
Electronics Forum | Fri Sep 11 15:26:15 EDT 1998 | Upinder Singh
Dave, What exactly is the material used for making the fixtures? Upinder ====================== | I am running composite fixtures on my wave solder machine and after about 500 passes each (1 month)they are showing serious signs of wear in that the co
Electronics Forum | Fri Apr 05 13:42:05 EST 2002 | dougt
We have been using a silicone encapsulated, high flex, flat cable for a short time now and have not been succusfull in terminating it to connectors with shell housings designed for round cable. Our solution thus far has been to leave the housing off
Electronics Forum | Wed Apr 24 13:23:37 EDT 2002 | gsmguru
Our design group is looking at using a IMPCB material for a power amplifier design. They would like to to use this because of it's excellent thermal properties. This would be used to create a "SIP" module that would plug into a std FR4 pcb with the c
Electronics Forum | Wed Aug 14 21:13:30 EDT 2002 | davef
Insulating tab approach, like: * Go to page 5 of http://www.kalatel.com/lit-rack/install-man/kts_253_253-16_man.pdf * http://support.tandy.com/support_radios/doc64/64039.htm * Go to �Fixing�, Step 6 of http://www.sunvic.co.uk/TLX%20Digital%20Room%2
Electronics Forum | Mon Jan 13 21:52:16 EST 2003 | davef
Haaaaaa!!!! You contractors get all the fun don't ya??? Consider: * Replacing the balls on the corners of the devices with balls composed of a "hard solder", yano something like 90/10. * Shimming to prevent excessive collapse of a heavy BGA during
Electronics Forum | Mon Mar 31 11:10:43 EST 2003 | davef
First, most �thermal shock� recipes are not a reliability test. There is no relationship between the failures seem in these tests and in-use application. These tests show you the failures in these tests. That�s it!!! Second, accelerated life test
Electronics Forum | Thu Apr 17 16:43:09 EDT 2003 | davef
Background: * Bulwith, Ronald A., �Failure Analysis of Solder Joints�, �Insulation/Circuits� magazine, February 1978 * Banks, Donald R., et al., �The Effects of Solder Joint Voiding on Plastic Ball Grid Array Reliability�, Proceedings of the Technica
Electronics Forum | Mon Jul 07 00:22:38 EDT 2003 | sam
Thanks for all the answers. I should clarify that the problem was found to be on the SMT LED gold plating, instead of PCB gold plating. We had confirmed this problem by running some DOE experiments and some reliability testings. We had decided to d
Electronics Forum | Wed Aug 25 21:25:28 EDT 2004 | davef
First as a nit, your �substrate� is probably NOT copper. It�s probably FR4 fiberglass/epoxy. Substrate. Base Material. A supporting insulating material upon which parts, components, and elements are attached. Second, enough of that, on to your i
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