Electronics Forum | Fri Dec 09 11:00:47 EST 2011 | davef
Using common wire size and through hole diameter, we'd expect that the wave solder process would completely fill the through hole and that you wouldn't need to get involved in providing stencil openings, pasting the through hole or reflowing the jump
Electronics Forum | Tue Sep 16 15:54:39 EDT 2014 | gascon5383
I have not tried running it 180 or 90 degrees out. The process involved to change that would be too large for my company to accept it. I see where you can adjust the board stop x and y but is there a way for the z axis? I have found that the board is
Electronics Forum | Sat Oct 16 03:04:21 EDT 2021 | jessicasu
> Slanting Issues after reflow if u are using <BR> > thru-hole type, u might need to define the <BR> > slanting degree allowed during prototype. =) <BR> <BR> there is adding the insulating plastic will sol
Electronics Forum | Fri Jan 21 19:20:31 EST 2022 | SMTA-64304163
Can someone who designs IMS printed circuit boards advise us on how to document the materials on the drawing. We are looking for applicable specifications to reference along with the physical specs. The current design is 066 +/-.006. .059 al, .0028
Electronics Forum | Tue Jun 21 17:27:10 EDT 2022 | kojotssss
Offcourse, RH is between 47-50%. The cause of problem is that the one of the embossed carrier reels/package materials coming from supplier static charged. Material now is like insulating, not dissipative or conductive. Example: https://drive.google.
Electronics Forum | Wed Apr 24 21:25:46 EDT 2002 | davef
PROPER GROUNDING OF THE "OBJECT" PCBA BOARD: You cannot ground an insulator. Insulators accumulate a charge, but the charge must be neutralized, usually by ionization. We only use ionizers at tape stations and bins where travelers and other paper
Electronics Forum | Thu Jan 08 16:43:43 EST 2004 | Dean
Unless your machine (internal) thermocouples are each calibrated and compensated no two machines will deliver eactly the same results. Here are your challenges: 1. Data acquisition equipment A-D converter errors 2. PCB measurement thermocouple (t
Electronics Forum | Wed Aug 21 17:44:32 EDT 2002 | davef
Splitting hairs, I expect SIR of all solderability protection, including OSP, to decrease after reflow. What�s more, I expect the SIR of all solderability protection to pretty much decrease over time. The �comb pattern� test specimens meet requirem
Electronics Forum | Mon Aug 21 20:28:15 EDT 2000 | Dave F
Hey CK: I do not know who makes the "orange cover that goes over a WinKic datalogger". Maybe someone at KIC can give you a source. Further, John makes good points. Have you talked to your power brick whatever supplier? Alternately, consider usin
Electronics Forum | Wed Oct 20 19:36:45 EDT 1999 | Dennis O'Donnell
Hi Mark: Running a wire under a BGA is possible, however if you plan to mount the BGA over the wire you would want to make sure that the wire insulation will withstand the heat of the reflow temperature. A more reliable way would be to lay a trace
