Electronics Forum: intel (Page 1 of 9)

Re: Moisture Sensitive devices

Electronics Forum | Mon Nov 29 13:16:58 EST 1999 | Michelle Ogihara

Hello John, Lots of hints and info can be found on Intel's site: http://developer.intel.com/design/quality/icstorage/moisture_sensitivity.htm. Hope this helps. Regards, Michelle.

Motherboard become NO POST when humidity increase to 90%

Electronics Forum | Sat Nov 21 02:04:47 EST 2009 | Sean

Hi Patrick, Sorry, it should be Intel's Southbridge BGA instead of Intel's Northbridge BGA.. Thanks, Sean

Intel® Core™ i3-5157U Processor soldering (CL8064701478404)

Electronics Forum | Thu May 14 05:20:31 EDT 2015 | kielbik

Hi Im looking for a person who have a experience with Intel® Core™ i3-5157U (i5) Processor soldering (CL8064701478404). I want to compare our experience because i'm not sure about aur spare parts and our soldering way. They are original or not, becau

part orientation

Electronics Forum | Mon Jun 30 12:54:55 EDT 2008 | realchunks

Intel uses the dot in their letter "i". Hmmm, go figure.

Re: Automatic site cleaning machine for BGA rework

Electronics Forum | Wed Jan 20 03:31:28 EST 1999 | Patrick O' Herlihy

Need recommendation for Automatic site cleaning machine for BGA rework. (after component removal). Advice on BGA reballing equipment/methods is needed. thanks a lot Lin You can find some info on reballing at intels site http://d

Baking Moisture Sensitive Components >4.5mm

Electronics Forum | Mon Jan 22 16:41:21 EST 2007 | davef

Contact: * JC-14.1 Subcommittee on Reliability; Chair: Jack McCullen, Intel; jack.t.mccullen@intel.com 480-554-5354 * Rich Shook, Brian Vaccaro, and Brian Pottieger - Agere Systems [ http://www.agere.com ] * Francois Monette; Cogiscan Inc.; 450-534-2

Intel FCPBGA Contact Pins

Electronics Forum | Wed Jun 17 17:26:26 EDT 2009 | bandjwet

We are having to put an Intel Core 2 Duo Solo mobile processor in a 478-pin micro FCPGA package into a ZIFF socket. The devices currently only have lands (device rework) and we would like to attach the pins. Does anyone know the material compositio

Lead-free BGA in Tin/Lead Process

Electronics Forum | Wed Oct 06 17:50:00 EDT 2010 | jamyboy

IBM Intel motorola did exhaustive studies on this and found that the best thing to do is (as others pointed out) the PBfree BGA reaches 217 minimum and the time above 217 must be extended to allow mixing of the 2 alloys. See attached a little diddy

Re: Silver Epoxy and CEM3

Electronics Forum | Thu Aug 27 17:40:11 EDT 1998 | Earl Moon

Does anyone have any experience they are willing to share on Ag epoxy used as a copper through hole plating replacement? Was CEM3 used? What are the limitations? Thanks, Steve Steve, Hello again. Hope you guys (Intel) aren't going to do that

Re: BGA standards

Electronics Forum | Fri Jun 09 14:00:08 EDT 2000 | khalid

I am not aware if there is any standard but INTEL web site has some really good step by step process for reworking BGA's. Khalid Saeed

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