Electronics Forum | Thu Feb 10 12:47:47 EST 2022 | bukas
1. disable driver update (system and regkeys) 2. reboot in safe mode 3. disconnect internet 4. uninstall any nvidia driver using IO Bit uninstaller 5. uninstall nvidia and intel drivers using DDU 6. reboot in normal mode 7. install intel driver from
Electronics Forum | Mon Nov 29 13:16:58 EST 1999 | Michelle Ogihara
Hello John, Lots of hints and info can be found on Intel's site: http://developer.intel.com/design/quality/icstorage/moisture_sensitivity.htm. Hope this helps. Regards, Michelle.
Electronics Forum | Sat Nov 21 02:04:47 EST 2009 | Sean
Hi Patrick, Sorry, it should be Intel's Southbridge BGA instead of Intel's Northbridge BGA.. Thanks, Sean
Electronics Forum | Thu May 14 05:20:31 EDT 2015 | kielbik
Hi Im looking for a person who have a experience with Intel® Core™ i3-5157U (i5) Processor soldering (CL8064701478404). I want to compare our experience because i'm not sure about aur spare parts and our soldering way. They are original or not, becau
Electronics Forum | Mon Jun 30 12:54:55 EDT 2008 | realchunks
Intel uses the dot in their letter "i". Hmmm, go figure.
Electronics Forum | Wed Jan 20 03:31:28 EST 1999 | Patrick O' Herlihy
| Need recommendation for Automatic site cleaning machine for BGA rework. (after component removal). | | Advice on BGA reballing equipment/methods is needed. | | thanks a lot | | Lin | You can find some info on reballing at intels site http://d
Electronics Forum | Mon Jan 22 16:41:21 EST 2007 | davef
Contact: * JC-14.1 Subcommittee on Reliability; Chair: Jack McCullen, Intel; jack.t.mccullen@intel.com 480-554-5354 * Rich Shook, Brian Vaccaro, and Brian Pottieger - Agere Systems [ http://www.agere.com ] * Francois Monette; Cogiscan Inc.; 450-534-2
Electronics Forum | Wed Jun 17 17:26:26 EDT 2009 | bandjwet
We are having to put an Intel Core 2 Duo Solo mobile processor in a 478-pin micro FCPGA package into a ZIFF socket. The devices currently only have lands (device rework) and we would like to attach the pins. Does anyone know the material compositio
Electronics Forum | Wed Oct 06 17:50:00 EDT 2010 | jamyboy
IBM Intel motorola did exhaustive studies on this and found that the best thing to do is (as others pointed out) the PBfree BGA reaches 217 minimum and the time above 217 must be extended to allow mixing of the 2 alloys. See attached a little diddy
Electronics Forum | Thu Aug 27 17:40:11 EDT 1998 | Earl Moon
| Does anyone have any experience they are willing to share on Ag epoxy used as a copper through hole plating replacement? Was CEM3 used? | What are the limitations? | Thanks, | Steve Steve, Hello again. Hope you guys (Intel) aren't going to do that
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