Electronics Forum | Wed Jul 02 07:00:56 EDT 2003 | davef
Title : SOLDER JOINT RELIABILITY OF Sn-Ag-Cu BGA COMPONENTS ATTACHED WITH EUTECTIC Pb-Sn SOLDER PASTE Author : Fay Hua et al. Author Company : Intel Corporation Date : 01/01/2003 Source : Journal Of Surface Mount Technology, Volume 16-
Electronics Forum | Fri Jun 18 17:45:30 EDT 1999 | Scott Cook
This is my second attempt at it. I still own a home near the golf course South of Bentley. You guys can't mean you had your beginnings there. Moonman Ah, My moonie buddie......not our beginnings. But I was mid-stroke in the old career. Mike w
Electronics Forum | Tue Oct 20 10:57:18 EDT 1998 | Craig Ramsey
Dear Bob, The Tessera microBGA technology defines a family of CSP devices. The most common microBGA type is the TV46 that has been selected by Intel for use with their flash memory devices. A microBGA package in general consists of the silicon die
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