Electronics Forum | Tue Jun 20 14:58:22 EDT 2006 | smt_guru
Allow me to make some recommendations. This is my firm's bread and butter, so to speak. Helping startups like yourself achieve their budget objectives, but in the process being innovative and thinking outside of the box. Here are my suggestions----
Electronics Forum | Thu Mar 22 06:28:08 EDT 2007 | Hussman
Anyone ever design an external thermocouple that connected back to an enclosed PCB? If so, how did you make the interconnect or solder joint to the board? Did you change metals to a solder friendly material? The problem we have is an external t-
Electronics Forum | Tue Feb 12 17:57:42 EST 2008 | chef
I must ask the silly question- are you sure you deposited the correct amount of paste? Depending on aperature design-the voiding could come from a stencil that has its holes partially built up with old paste. If paste volume is guaranteed, then what
Electronics Forum | Sun Jun 07 09:01:47 EDT 2009 | davef
IPC T-50, Revision H, Terms and Definitions for Interconnecting and Packaging Electronic Circuits, 96.2176 Pad Cratering. A separation of the pad from the printed board resin/weave composite or within the composite immediately adjacent to the pad as
Electronics Forum | Tue Nov 06 10:06:33 EST 2018 | davef
Electronic Connector Industry News Resources + Surface Finishing + Metal Finishing + Products Finishing + Interconnection World (Connector Specifier) Electronic Connector Associations + IEEE USA + International Electronics Manufacturing Initiative (
Electronics Forum | Tue May 28 18:31:08 EDT 2019 | jlawson
Solder paste flux is main contributor, Lead termination chemical-oxide by products and PCB Plating-Chemicals. Reflow profile would have very limited if not no impact really unless is way off. Paste volume control and Stencil design plays a big part
Electronics Forum | Thu Sep 30 03:37:26 EDT 1999 | Brian
| We are all faced with increasing interconnect density in all we do. This means smaller everything, especially components and that which they are mounted upon but, hopefully, without smaller minds and thoughts. It all demands more process control an
Electronics Forum | Fri Oct 01 00:18:18 EDT 1999 | Earl Moon
| | We are all faced with increasing interconnect density in all we do. This means smaller everything, especially components and that which they are mounted upon but, hopefully, without smaller minds and thoughts. It all demands more process control
Electronics Forum | Fri Oct 01 09:03:25 EDT 1999 | Dave F
| | | We are all faced with increasing interconnect density in all we do. This means smaller everything, especially components and that which they are mounted upon but, hopefully, without smaller minds and thoughts. It all demands more process contro
Electronics Forum | Fri Dec 13 10:23:55 EST 2002 | davef
Bright ideas??? Bright ideas!!! I got bright ideas. In order of decreasing luminosity: * Stop installing the socket, solder the PLCC to the board, dip the board. The socket is a waste of time and money. You never replace the PLCC in the field, a
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