Electronics Forum | Tue Apr 11 16:42:56 EDT 2000 | Chad Notebaert
I�m thinking �Poor intermatallic� It could be a few things. Lets start at the beginning. -Is your paste a 63/37 mixture? -Have you monitored you screen printing, Verify Solder deposition, Are you getting enough paste? -You say the solder looks like i
Electronics Forum | Thu Oct 20 05:58:19 EDT 2005 | Slaine
Hi could be relaited to the thermal mass of the screw/bolt. if there is no intermatalic formed and the solder just picks off id say this is likely. the hot wave hits the cold screw and cools the solder enought to leave some behind??
Electronics Forum | Thu Aug 27 16:03:20 EDT 2009 | jim_n_hky
We recently had a very similar issue with BGA breaking off at the pad. We sent samples to a lab for SEM / EDX and they found that there was no intermatalic with the nickel, or very little do to high phosphorus. I recommend you get a board to a lab AS
Electronics Forum | Fri Jan 16 14:42:44 EST 2009 | realchunks
Kester R562 is a 63/37 paste. Not ideal for no-lead parts. I bet you are seeing no-lead BGAs and they will become very weak using your old proile and paste (been there - done that). You can try a hotter profile but will probably just burn off your
Electronics Forum | Fri Jan 14 07:55:07 EST 2000 | Pat Pepper
Hi Wolfgang, Thanks for the response. We had a similar situation to yours with some white tin samples that sat around for about eight months. Samples soldered right after they arrived soldered better than the ones we soldered eight months down the
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