Electronics Forum: intermetallic layer (Page 1 of 11)

intermetallic question

Electronics Forum | Thu Apr 09 00:35:06 EDT 2009 | padawanlinuxero

Hello! I am in a little problem, theres a problem in one of the components, is a new component that we are working with the leads are tin coated, and after we solder in the reflow oven, with lead solder, we took them to do a some test and on a cros

intermetallic question

Electronics Forum | Sat Apr 11 09:56:31 EDT 2009 | davef

You're correct. You should expect to see an intermetallic layer in a proper solder connection. Try leaving the component at temperature for a longer period. Growth of intermetallic compounds on Cu surfaces [Klein Wassink]: d = 10^3(exp(-5*10^3/T)t^1

Intermettalic layer analyssis

Electronics Forum | Fri Sep 28 07:42:07 EDT 2007 | zanolli

We have the need to verify that proper intermetallic layer between a 100% Sn plated contact and the solder joint is being formed. Never having done this before: Is there any specifications, etc. that we can use as acceptability criteria?

Intermettalic layer analyssis

Electronics Forum | Fri Sep 28 16:49:48 EDT 2007 | davef

good * No IMC => bad Intermetallic growths are diffusion limited, and therefore the thickness of the intermetallic is given by: z^2 = (Do)(t)exp[-Q/RT] Where Do (m^2 s-1) is the diffusion coefficient, T(�K) is the temperature, Q (J mol-1) is the act

Shear strength and Copper/Tin Intermetalic layer

Electronics Forum | Mon Jul 06 20:32:34 EDT 1998 | Chiakl

Hi there, I am looking for some informations concerning the shear or pull strength of a typical TQFP 20 mils leads in relationship with the Copper/Tin intermetalic layer thickness. Could anyone help? Thank in advandce. rgs, chiakl

Re: Shear strength and Copper/Tin Intermetalic layer

Electronics Forum | Thu Jul 09 21:04:50 EDT 1998 | Dave F

Hi there, I am looking for some informations concerning the shear or pull strength of a typical TQFP 20 mils leads in relationship with the Copper/Tin intermetalic layer thickness. Could anyone help? Thank in advandce. rgs, chiakl Chiakl

simple doubt about reflow profile

Electronics Forum | Mon Feb 12 13:58:10 EST 2007 | campos

Tks for the answers,, My concern is about the intermetalic layer,,I run SMQ230 LEAD FREE paste.. its liquidous at 217C..the oven have 7 zone, but I run in 5 zones also with a more agressive profile (due to the line rate)..I would like to know if runn

Re: Shelf Life of Components

Electronics Forum | Fri Dec 03 18:01:39 EST 1999 | Dave F

Chris, Two points of perspective are: 1 Solderability: The shelf life of components has elapsed when they are no longer solderable. There's tons of variables that affect this, but keys are: * Intermetalics grow as a function of temperature. * Th

PCB Pad become brownish after IR reflow

Electronics Forum | Thu Sep 17 04:48:51 EDT 2009 | grahamcooper22

The colour you see on the pads is tin/copper intermetallic layer. In your reflow the immersion tin coating and the copper pad underneath react to form in intermetalic layer. The effect is worse the hotter the pcb or area of the pcb gets. In IR reflow

Double reflowing BGA's

Electronics Forum | Fri Oct 10 13:35:56 EDT 2003 | swagner

Does anyone have any data about the dangers of reflowing BGA's twice? I have a customer that is concearned about cracking in the intermetallic layer after the second pass. Thanks in advance.

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