Electronics Forum | Mon Oct 30 13:26:09 EST 2000 | stefano bolleri
Ramon, I have placed BGAs before with an IP-2. It can be done, but with limitations: IP-2 can only see shape of BGAs, not balls (back-light only). Is this OK for you? I only placed components with balls having 50mil pitch, and the centering with bod
Electronics Forum | Wed Sep 20 19:34:13 EDT 2000 | Dave F
Congrats. You now control the source of almost 70% of the defects of your SMT operation. There is a neat series of presentations on printing, each year at SMI. One of the best of the SMI series was in 1997, because presenters used a common board
Electronics Forum | Wed May 10 17:22:43 EDT 2000 | Earl Moon
Andy, I have no bad feelings about this forum. I want more than most to see it succeed. We need a high technology capability to present exactly that. It ain't doing that anymore. You're appealing to the wrong person to promote you new positive think
Electronics Forum | Thu Mar 08 05:49:11 EST 2001 | Dreamsniper
Hi, We are encountering a shortage on our parts and our purchasing said that the parts, which is in PLCC packaging, is hard to order from the local and international market and we can only get them in QFP packaging. Now the problem enters here. Our P
Electronics Forum | Wed Mar 14 11:51:24 EST 2001 | fmonette
Popcorning is the common designation for defects related to the moiture sensitivity of plastic molded components, like PBGAs. The plastic body of these parts will absorb moisture from the ambiant atmosphere on your factory floor. If a critical level
Electronics Forum | Tue Nov 28 14:31:10 EST 2000 | rabell
This is certainly an excellent question. We have shied away from going web based for several reasons: 1. Yes - bandwidth is a real issue. Research into instructional effectiveness of computer based training shows that students lose interest if res
Electronics Forum | Thu Jul 12 17:43:50 EDT 2001 | Steve
In order to understand your printing process, you cannot rely soley on 2D inspection. By implementing 3D-true volumetric measurement, a more comprehensive approach to correcting the process variation can be established. True volumetric / 3D inspect
Electronics Forum | Wed Jul 18 08:00:48 EDT 2001 | davef
250C flass transition temperature - M = coloring agent or opacifier added to F resin with 110-150C glass transition temperature - N = natural color of resin - P = coloring agent or opacifier added to resin - T = natural color F resin blended with
Electronics Forum | Tue Feb 01 21:48:12 EST 2000 | Dave F
Guo: You want to know: 1 Can I use water as the solvent in an ultrasonic machine to remove solder paste from PCB? Continuing from Jason�s comments: Sure you can use water as the solvent to remove solder paste from PCB, but recognize that some flu
Electronics Forum | Tue Jan 25 14:25:47 EST 2000 | Mark Miller
Has any one experienced hand soldering through hole components to white tin plated PCB's using no-clean wire solder? Our facility is presently evaluating white tin vs Sn/Pb coatings. Our only difficulty at this time has been hand soldering of wires
Industrial Sensor Vision International specializes in advanced camera technology of high resolution fast speed cameras for automation, AOI, 2-D/3-D, SPI inspection and wafer inspection.
3 Morse Road 2A
Oxford, CT USA
Phone: +1 203 592 8723
