Electronics Forum | Thu Dec 31 14:20:35 EST 1998 | Michael Allen
Kelvin, Yes, we're referencing the same spec. I performed the test under the Class 2 conditions (except that I used a 100V bias rather than 50V...but my water-washed microBGAs still passed). Regarding the omegameter test: we have this instrument,
Electronics Forum | Wed Sep 12 18:11:03 EDT 2001 | davef
First, what on the area array package are you analyzing � * Package cracking? * Cracked solder balls? * Er, what? Second, most failure analysis discussions consider dye penetration to be a non-destructive test, but then again most failure analysis
Electronics Forum | Mon Apr 28 15:20:50 EDT 2014 | davef
Your customer is correct. Your supplier has clamped some sort of machine to your butt and has plugged it in the wall outlet. Honest mistake: * IPC-A-600H, 3.3.2 Lifted Lands - (Cross Sections) ... pertains to boards that were cross sectioned after t
Electronics Forum | Thu Dec 20 11:09:57 EST 2001 | stevearneson
Also check out the ASC International machine called VisionMaster. This true 3D inspection system has been around for at least 3 years. It provides the highest level of paste measurement in its class. The software is also very easy to operate. The
Electronics Forum | Mon Mar 07 20:22:05 EST 2005 | KEN
Here are some general rules for lead free wave solder: Noble aloys will cost more. Period. The cheapest metal on earth is lead. Costs can only go up in Lead Free. Consumer grade and class 2 electronics will most likely use Tin / Copper for wave.
Electronics Forum | Fri Oct 16 13:11:49 EDT 1998 | Steve A
The Kyzen product was brought to my attention from a chemist at Kester solders when I asked him what could remove no clean residue from a PCB that had been built weeks earlier. We soaked it in the Kyzen for 8 minutes and ran the board through the aq
Electronics Forum | Mon May 27 12:24:21 EDT 2002 | arcandspark
Carol, I beleive there is an IPC spec for Moisture control. We see all kinds of problems with boards coming from the vendors. We use to bake all bare fabs upon recieving them. This helped alot but waste time. We now rely on the board vendors to bake
Electronics Forum | Tue Apr 12 19:31:39 EDT 2005 | davef
Tell your fab that you'd like your ENIG according to IPC-4552. Just so that you know, IPC-4552 ENIG specification: * Ni thickness: 3 - 6 microns [120 - 240 microinches]. * Au thickness: 0.075 - 0.125 microns [3 - 5 microinches]. * Recommended spec
Electronics Forum | Tue Jul 19 03:06:42 EDT 2016 | ishwarsingh1
Upside down placement of a crystal oscillator is acceptable or not ?? As per IPC 8.3.2.9.2 Rectangular or Square End Chip Components – 1, 3 or 5 Side Terminations.I am not sure whether is applicable for crystal oscillator or not . Your answer wo
Electronics Forum | Wed Sep 26 16:32:40 EDT 2001 | davef
Placing a component the correct side up: * May affect heat dissipation. [Umm, that sounds like stretch, but who knows what designers think about?] * Allows reading the markings on those components that have markings, however cryptic the notation of
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