Electronics Forum | Mon Jul 29 08:34:40 EDT 2013 | gallionc
I don't see an issue. As was mentioned before, it is what the customer wants. You could approach this from one of two ways. You could simply install the parts, clinch the leads on the opposite side for added mechanical strength and solder the parts
Electronics Forum | Tue Jan 29 08:21:50 EST 2019 | electronics101
Hi All, Can someone please help, I have a number of tall surface mount components that according to IPC 610 (8.2.2.3) are a fail due to the end termination not wetting at least 0.5mm + solder height. The components are very well soldered but the sol
Electronics Forum | Tue Oct 15 11:16:30 EDT 2019 | charliedci
We have been using Cree 3 color LED's (CLV6A-FKB) in many products for several years (pic attached). At the rate of 3 to 5% of the units assembled with this LED, the Red LED fails. After touch up with soldering iron it functions. This happens to the
Electronics Forum | Tue Feb 11 12:59:06 EST 2020 | astarotf
Hi Steve Thomas Effectively by IPC-610 standard specifies in the "content 8.2.13 Quad Flat Pack Plastic Package - Without Terminals (PQFN), Table 8-13, page 8-84" which depending on the class of manufacture notes 2-5 of the table, which in theory do
Electronics Forum | Tue Jan 26 16:29:48 EST 2021 | charliedci
We will be exploring the exciting world of step stencils for the first time and I am looking for any advice from anyone using regularly. This direction is because we have large caps and soldered standoffs along with medium pitch LGA's and QFP's on sa
Electronics Forum | Wed Oct 24 09:11:54 EDT 2001 | John S
Does anyone have any guidelines or IPC standard they can suggest for specifying the type of solder mask used? We've started having problems with poor masking, and when I asked our designers what they use as a specification, they can't give an answer
Electronics Forum | Fri Mar 19 13:42:05 EST 2004 | blu_nozer
J-STD-001 is the workmanship standard. IPC-A-610 is a guide to evaluating conformance to the standard & includes photographs of compliant and non-compliant examples. In addition there is also IPC-HDBK-001 which expands on the bare requirements laid d
Electronics Forum | Thu Jun 01 08:39:36 EDT 2006 | russ
IPC a 610 has this info. An 0402 however mat require more solder than what IPC states (basically evidence of wetted fillet for class2). more paste = more flux = better wetting. Why don't you tell us what pad sizes and layout you have and stencil t
Electronics Forum | Tue Jul 04 14:50:52 EDT 2017 | dleeper
Thanks! good stuff. I am disappointed the IPC has put off updating QFN solder filet specs till rev H. It's a pet peeve of mine trying to argue with customers that a visible toe filet on a QFN is not necessary, and may not even be possible depending
Electronics Forum | Mon Nov 26 09:33:49 EST 2018 | charliedci
The problem you create by soldering from solder destination side (presuming you have already soldered from other side) is that you will trap air in PTH so you have virtually no continuous solder in PTH from one side to other. This will not meet IPC-A
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