ipc 610

"ipc 610" search results in the Electronics Forums



397 results found for "ipc 610" in the Electronics Forums

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Electrical Test problem

Jan 18, 2018 |

Through hole SMD in SMT process-Length question

Jul 19, 2016 | I'm not real clear on what you're looking to understand, but let me get things started ... IPC-A-

Fiber exposed on board edge

Jan 14, 2016 | IPC-A-610F 10.2.6 Laminate Conditions - Depanelization talks to the acceptability of the depanelizat

Modems reflow mistake

Oct 12, 2015 | IPC-A-610E-2010, Acceptability of Electronic Assemblies, 8.3.4 Castellated Terminations talks to the

Solder wicking up on connector leads

Sep 21, 2014 | hi, there is an IPC standard, IPC-A-610 - Acceptability of Electronic Assemblies. According to th

Ion Chromatography Testing Standard

Sep 26, 2013 | I know - A stimulating topic.... IPC-TM-650 2.3.28 method calls for a PCBA or PCB to be placed in

THM Solder barrel fill issues on 93 mils board

Aug 21, 2013 | I am having solder barrel fill issues on THM component, we follow, we follow IPC 610 E requirement.

Conformal Coating

Nov 1, 2011 |

Solder cover

Mar 8, 2010 |

Solder cover

Mar 6, 2010 |

ESD HANDLING FOR PCBA

Nov 2, 2009 | Hi..., We have build the PCBA base on IPC 610 and J-std-001 class 3 product, All the ESD pre caut

QFN's and LGA's

May 20, 2009 |

BGA voids

Apr 23, 2009 |

Solder on Gold Fingers?

Mar 13, 2009 |

PCB Burned after reflow?

Mar 5, 2009 | Solder mask requirements: * IPC-6012 and IPC-SM-840 contain detailed specifications and information

Solder On Gold Mounting Holes, Gold Pressure Fit Socket Lands

May 6, 2008 | I know IPC-A-610 RevD has requirements for Gold Fingers and solder contamination. Is there any such

SMT component handling

May 11, 2007 | IPC-A-610D 3 Handling Electronic Assemblies 3-1 3.1 EOS/ESD Prevention 3-2 3.1.1 Electrical Overs

solder SnPb wire to gold plated IC

Apr 16, 2007 | Standard for appearance: J-STD-001 and IPC-A-610 committees eliminated the requirement that solder c

SMD flatness standard

Nov 20, 2006 | Sorry for stating this incorrectly. It should been: Bow & twist for bare boards and panels: IPC-A-6

Orbotech AOI

Apr 17, 2006 |

Fillet Tearing

Mar 23, 2006 | Dear all, Referring comment from Mr. Jack,IPC director certification & assembly technology, the t

Fillet Tearing

Mar 22, 2006 |

cleaning spec

Mar 8, 2006 |

Micro crack for lead free wave solder

Aug 2, 2005 | IPC-A-610D Section 5, shows a variety of photographs of: * Good lead-free solder connections * Le

Probing Vias

Jul 20, 2005 | With the new rev D release of IPC-A_610 came a new section 10.2.9.3 which identifies a via (through

Chromatography

High Precision SMT Fluid Dispensers